Zombini i-SoC (iNkqubo kwi-Chip) kunye ne-SiP (iSistim kwiPhakethi) ziyimilinganiselo ebalulekileyo ekuphuhlisweni kweesekethe ezidibeneyo zanamhlanje, okwenza ukuba i-miniaturization, ukusebenza kakuhle, kunye nokuhlanganiswa kweenkqubo zombane.
1. Iinkcazo kunye neeNgcebiso eziSisiseko ze-SoC kunye ne-SiP
I-SoC (Inkqubo kwi-Chip) - Ukudibanisa yonke inkqubo kwi-chip enye
I-SoC ifana ne-skyscraper, apho zonke iimodyuli ezisebenzayo zenzelwe kwaye zihlanganiswe kwi-chip efanayo yomzimba. Ingcamango engundoqo ye-SoC kukudibanisa zonke izinto eziphambili zenkqubo ye-elektroniki, kuquka iprosesa (CPU), imemori, iimodyuli zonxibelelwano, iisekethe ze-analog, i-sensor interfaces, kunye nezinye iimodyuli ezisebenzayo, kwi-chip enye. Iingenelo ze-SoC zilele kwinqanaba eliphezulu lokudityaniswa kunye nobukhulu obuncinci, ukubonelela ngeenzuzo ezibalulekileyo ekusebenzeni, ukusetyenziswa kwamandla, kunye nemilinganiselo, okwenza ukuba ifaneleke ngokukodwa ukusebenza okuphezulu, iimveliso ezithatha amandla. Iiprosesa kwii-smartphones ze-Apple ziyimizekelo yeechips ze-SoC.
Ukwenza umzekelo, i-SoC ifana ne "super building" kwisixeko, apho yonke imisebenzi iyilwe ngaphakathi, kwaye iimodyuli ezahlukeneyo ezisebenzayo zifana nemigangatho eyahlukeneyo: ezinye ziindawo zeofisi (iiprosesa), ezinye iindawo zokuzonwabisa (imemori), kwaye ezinye zikho. uthungelwano lonxibelelwano (unxibelelwano lonxibelelwano), zonke zigxininiswe kwisakhiwo esifanayo (i-chip). Oku kuvumela inkqubo yonke ukuba isebenze kwi-silicon chip enye, ifezekisa ukusebenza kakuhle kunye nokusebenza okuphezulu.
I-SiP (Inkqubo kwiPakethi) - Ukudibanisa iichips ezahlukeneyo kunye
Indlela yeteknoloji yeSiP yahlukile. Kufana nokupakisha iitshiphusi ezininzi ezinemisebenzi eyahlukeneyo ngaphakathi kwephakheji efanayo yomzimba. Ijolise ekudibaniseni iichips ezininzi ezisebenzayo ngokusebenzisa itekhnoloji yokupakisha kunokuba idibanise kwichip enye njenge-SoC. I-SiP ivumela iichips ezininzi (iiprosesa, imemori, iitshiphusi zeRF, njl. njl.) ukuba zipakishwe ecaleni okanye zifakwe ngaphakathi kwimodyuli efanayo, zenze isisombululo senqanaba lenkqubo.
Ingqikelelo yeSiP inokufaniswa nokudibanisa ibhokisi yesixhobo. Ibhokisi yezixhobo inokuqulatha izixhobo ezahlukeneyo, ezifana nezikrurudrayiva, iihamile kunye needrili. Nangona zizixhobo ezizimeleyo, zonke zimanyene kwibhokisi enye ukuze zisetyenziswe ngokufanelekileyo. Inzuzo yale ndlela kukuba isixhobo ngasinye sinokuphuhliswa kwaye siveliswe ngokwahlukileyo, kwaye "zinokuhlanganiswa" kwiphakheji yenkqubo njengoko kufuneka, ukubonelela ukuguquguquka kunye nesantya.
2. Iimpawu zobuGcisa kunye noMahluko phakathi kwe-SoC kunye ne-SiP
Umahluko weNdlela yoHlanganiso:
I-SoC: Iimodyuli ezahlukeneyo zokusebenza (ezifana ne-CPU, imemori, i-I / O, njl.) zenzelwe ngokuthe ngqo kwi-silicon chip efanayo. Zonke iimodyuli zabelana ngenkqubo esisiseko efanayo kunye nengqiqo yoyilo, zenza inkqubo edibeneyo.
I-SiP: Iichips ezahlukeneyo ezisebenzayo zinokuveliswa kusetyenziswa iinkqubo ezahlukeneyo kwaye emva koko zidityaniswe kwimodyuli enye yokupakisha usebenzisa itekhnoloji yokupakisha ye-3D ukwenza inkqubo yomzimba.
UYilo oluMandundu kunye nokuGuquleka:
I-SoC: Ekubeni zonke iimodyuli zidityanisiwe kwi-chip enye, ubunzima boyilo buphezulu kakhulu, ngakumbi kuyilo lwentsebenziswano yeemodyuli ezahlukeneyo ezifana nedijithali, i-analog, i-RF, kunye nememori. Oku kufuna ukuba iinjineli zibe nesakhono soyilo esinzulu se-cross-domain. Ngaphezu koko, ukuba kukho umba woyilo kunye nayo nayiphi na imodyuli kwi-SoC, yonke i-chip inokufuna ukulungiswa kwakhona, ebeka umngcipheko omkhulu.
I-SiP: Ngokwahlukileyo, i-SiP ibonelela ngokuguquguquka okukhulu koyilo. Iimodyuli ezisebenzayo ezahlukeneyo zinokuyilwa kwaye zingqinwe ngokwahlukeneyo ngaphambi kokuba zipakishwe kwisistim. Ukuba kuvela umba ngemodyuli, yiloo modyuli kuphela ekufuneka itshintshwe, ishiya amanye amalungu engachaphazelekanga. Oku kukwavumela isantya sophuhliso olukhawulezayo kunye nemingcipheko ephantsi xa kuthelekiswa ne-SoC.
Ukuhambelana kweNkqubo kunye nemingeni:
I-SoC: Ukudibanisa imisebenzi eyahlukeneyo efana nedijithali, i-analog, kunye ne-RF kwitshiphu enye ijongene nemiceli mngeni ebalulekileyo kwinkqubo yokuhambelana. Iimodyuli ezahlukeneyo zokusebenza zifuna iinkqubo ezahlukeneyo zokuvelisa; umzekelo, iisekethe zedijithali zifuna isantya esiphezulu, iinkqubo zamandla aphantsi, ngelixa iisekethe ze-analog zinokufuna ulawulo oluchanekileyo ngakumbi. Ukufezekisa ukuhambelana phakathi kwezi nkqubo zahlukeneyo kwitshiphu enye kunzima kakhulu.
I-SiP: Ngetekhnoloji yokupakisha, i-SiP inokudibanisa iichips ezenziwe kusetyenziswa iinkqubo ezahlukeneyo, ukusombulula imiba yokuhambelana kwenkqubo ejongene netekhnoloji ye-SoC. I-SiP ivumela iichips ezininzi ezingafaniyo ukuba zisebenze kunye kwiphakheji enye, kodwa iimfuno ezichanekileyo zetekhnoloji yokupakisha ziphezulu.
Umjikelo weR&D kunye neeNdleko:
I-SoC: Kuba i-SoC ifuna ukuyila kunye nokuqinisekisa zonke iimodyuli ukusuka ekuqaleni, umjikelo woyilo mude. Imodyuli nganye kufuneka yenze uyilo olungqongqo, ukuqinisekiswa, kunye novavanyo, kwaye inkqubo yophuhliso iyonke inokuthatha iminyaka emininzi, okukhokelela kwiindleko eziphezulu. Nangona kunjalo, xa kusenziwa imveliso eninzi, ixabiso leyunithi liphantsi ngenxa yokuhlanganiswa okuphezulu.
I-SiP: Umjikelo we-R&D mfutshane kwi-SiP. Ngenxa yokuba i-SiP isebenzisa ngokuthe ngqo iitshiphusi ezisebenzayo ezikhoyo, eziqinisekisiweyo zokupakisha, inciphisa ixesha elifunekayo lokuyilwa ngokutsha kwemodyuli. Oku kuvumela ukuqaliswa kwemveliso ngokukhawuleza kwaye kunciphisa kakhulu iindleko ze-R&D.
Ukusebenza kweNkqubo kunye nobungakanani:
I-SoC: Ekubeni zonke iimodyuli zikwi-chip efanayo, ukulibaziseka konxibelelwano, ukulahlekelwa kwamandla, kunye nokuphazamiseka komqondiso kuncitshiswa, ukunika i-SoC inzuzo engenakulinganiswa ekusebenzeni kunye nokusetyenziswa kwamandla. Ubungakanani bayo buncinci, nto leyo eyenza ukuba ifaneleke ngakumbi kwizicelo ezinomgangatho ophezulu wokusebenza kunye neemfuno zamandla, ezinje ngee-smartphones kunye neechips zokuseta umfanekiso.
I-SiP: Nangona inqanaba lokudityaniswa kwe-SiP lingekho phezulu njengelo le-SoC, isenakho ukuhlanganisa iitshiphusi ezahlukeneyo kunye zisebenzisa itekhnoloji yokupakisha enezinto ezininzi, okukhokelela kubungakanani obuncinci xa kuthelekiswa nezisombululo zemveli ezininzi. Ngaphezu koko, ekubeni iimodyuli zipakishwe ngokwasemzimbeni kunokuba zidityaniswe kwi-silicon chip efanayo, ngelixa ukusebenza kusenokungafani naleyo ye-SoC, isenokuhlangabezana neemfuno zezicelo ezininzi.
3. Iimeko zokusetyenziswa kwe-SoC kunye ne-SiP
Iimeko zesicelo se-SoC:
I-SoC ifanelekile kumasimi aneemfuno eziphezulu zobungakanani, ukusetyenziswa kwamandla, kunye nokusebenza. Umzekelo:
Ii-smartphones: Iiprosesa kwii-smartphones (ezifana ne-Apple's A-series chips okanye i-Qualcomm's Snapdragon) zidla ngokudibanisa kakhulu ii-SoCs ezibandakanya i-CPU, i-GPU, iiyunithi zokucubungula i-AI, iimodyuli zonxibelelwano, njl., ezifuna ukusebenza okunamandla kunye nokusetyenziswa kwamandla aphantsi.
Ukucutshungulwa koMfanekiso: Kwiikhamera zedijithali kunye ne-drones, iiyunithi zokucwangcisa imifanekiso zihlala zifuna amandla okusebenza ahambelanayo kunye ne-latency ephantsi, enokuthi i-SoC iphumelele ngokufanelekileyo.
IiNkqubo zokuSebenza okuFanelekileyo: I-SoC ifanelekile ngokukodwa kwizixhobo ezincinci ezineemfuno ezingqongqo zobuchule bokusebenza kwamandla, njengezixhobo ze-IoT kunye nezinto ezinxitywayo.
Iimeko zeSicelo seSiP:
I-SiP inoluhlu olubanzi lweemeko zesicelo, ezifanelekileyo kwiinkalo ezifuna uphuhliso olukhawulezayo kunye nokuhlanganiswa kwemisebenzi emininzi, njengale:
Izixhobo zoNxibelelwano: Kwizitishi ezisisiseko, ii-routers, njl., i-SiP inokudibanisa ii-RF ezininzi kunye neeprosesa zesignali zedijithali, ukukhawuleza umjikelezo wophuhliso lwemveliso.
I-Electronics yabathengi: Kwiimveliso ezinjengee-smartwatches kunye ne-headsets zeBluetooth, ezinemijikelo yokuphucula ngokukhawuleza, itekhnoloji ye-SiP ivumela ukuqaliswa ngokukhawuleza kweemveliso ezintsha.
I-Electronics ye-Automotive: Iimodyuli zokulawula kunye neenkqubo ze-radar kwiinkqubo zeemoto zingasebenzisa iteknoloji ye-SiP ukudibanisa ngokukhawuleza iimodyuli ezisebenzayo ezahlukeneyo.
4. IiNdlela zoPhuhliso lwexesha elizayo ze-SoC kunye ne-SiP
Iintsingiselo kuPhuhliso lwe-SoC:
I-SoC iya kuqhubeka nokuguqukela ekudibaneni okuphezulu kunye nokudityaniswa okungafaniyo, okunokuthi kubandakanye ukudityaniswa okungaphezulu kweeprosesa ze-AI, iimodyuli zonxibelelwano ze-5G, kunye neminye imisebenzi, ukuqhubela phambili ukuvela kwezixhobo ezikrelekrele.
Iintsingiselo kuPhuhliso lwe-SiP:
I-SiP iya kuthembela ngakumbi kubuchwephesha bokupakisha obuphambili, obunje nge-2.5D kunye ne-3D yokuqhubela phambili kokupakisha, ukupakisha iitshiphusi eziqinileyo ezineenkqubo ezahlukeneyo kunye nemisebenzi kunye ukuhlangabezana neemfuno zemarike eziguquka ngokukhawuleza.
5. Isiphelo
I-SoC ifana nokwakha i-stop skyscraper enemisebenzi emininzi, igxile kuzo zonke iimodyuli ezisebenzayo kuyilo olunye, olulungele izicelo ezineemfuno eziphezulu kakhulu zokusebenza, ubungakanani, kunye nokusetyenziswa kwamandla. I-SiP, kwelinye icala, ifana "nokupakisha" iitshiphusi ezahlukeneyo ezisebenzayo kwisistim, igxile ngakumbi ekuguquguqukeni kunye nophuhliso olukhawulezayo, olulungele ngakumbi kubathengi be-elektroniki abafuna uhlaziyo olukhawulezayo. Bobabini banamandla abo: I-SoC igxininisa ukusebenza kakuhle kwenkqubo kunye nokulungiswa kobungakanani, ngelixa i-SiP igxininisa ukuguquguquka kwenkqubo kunye nokulungiswa komjikelo wophuhliso.
Ixesha lokuposa: Oct-28-2024