NgoMeyi 26, kwaxelwa ukuba iFoxconn icinga ukubhida kwi-Singapore-based semiconductor packaging kunye nenkampani yokuvavanya i-United Test and Assembly Centre (UTAC), enexabiso lentengiselwano elinokubakho ukuya kuthi ga kwi-3 yeebhiliyoni zeedola zase-US. Ngokutsho kwabangaphakathi kwishishini, inkampani yabazali be-UTAC iBeijing Zhilu Capital iqeshe ibhanki yotyalo-mali iJefferies ukuba ikhokele intengiso kwaye kulindeleke ukuba ifumane umjikelo wokuqala webhidi ekupheleni kwale nyanga. Okwangoku, akukho qela lithe lathetha ngalo mba.
Kubalulekile ukuqaphela ukuba uyilo lweshishini le-UTAC kwilizwe laseTshayina lenza ukuba ibe yeyona nto kujoliswe kuyo kubatyali-zimali abangengabo abase-US. Njengomvelisi omkhulu wekhontrakthi yehlabathi weemveliso ze-elektroniki kunye nomthengisi omkhulu kwi-Apple, iFoxconn inyuse utyalo-mali lwayo kwishishini le-semiconductor kwiminyaka yakutshanje. Yasekwa kwi-1997, i-UTAC yinkampani yokupakisha kunye nokuvavanya ingcali kunye neshishini kwiinkalo ezininzi ezibandakanya abathengi bombane, izixhobo zekhompyutha, ukhuseleko kunye nezicelo zonyango. Inkampani ineziseko zemveliso eSingapore, eThailand, eChina nase-Indonesia, kwaye ikhonza abathengi kubandakanya iinkampani zoyilo lwe-fableless, abavelisi bezixhobo ezidibeneyo (ii-IDM) kunye ne-wafer foundries.
Nangona i-UTAC ingekavezi idatha ethile yezemali, kuxelwe ukuba i-EBITDA yonyaka imalunga ne-US $ 300 yezigidi. Ngokuchasene nemvelaphi yohlengahlengiso oluqhubekayo kumzi-mveliso we-semiconductor wehlabathi, ukuba le ntengiselwano iyenzeka, ayizukuphucula kuphela amandla okudityaniswa okuthe nkqo kweFoxconn kwisixokelelwano sobonelelo lwe-chip, kodwa iya kuba nefuthe elinzulu kumhlaba wokubonelela nge-semiconductor yelizwe jikelele. Oku kubaluleke ngakumbi xa kujongwa ukhuphiswano oluya lusanda ngokwethekhnoloji phakathi kwe-China ne-United States, kunye nengqalelo ehlawulwe kukudityaniswa kwemizi-mveliso kunye nokufumana ngaphandle kwe-United States.
Ixesha lokuposa: Jun-02-2025