Imakethi yehlabathi yokupakishwa kunye novavanyo lwe-semiconductor kulindeleke ukuba iqhubeke nokukhula okuzinzileyo ngo-2026, iqhutywa kukunyuka kwemfuno evela kubukrelekrele bokwenziwa, izixhobo ze-elektroniki zeemoto, kunye nekhompyutha esebenza kakuhle.
Abahlalutyi beshishini baqaphela ukuba ubuchwepheshe obuphambili bokupakisha, kuquka ukupakisha okuphuma kwi-fan-out wafer-level (FOWLP), ukupakisha kwe-2.5D kunye ne-3D, kuya kubaluleka ngakumbi njengoko abavelisi beetships belandela ukuhlanganiswa okuphezulu kunye nezinto ezincinci zesimo.
Utyalo-mali olukhulayo kwizakhiwo zokwenza ii-semiconductor kwihlabathi liphela lukwaxhasa ukwandiswa kwekhonkco lokubonelela ngeepakethe. Njengoko izixhobo ze-elektroniki ziba nobuchule ngakumbi kwaye ziqhagamshelwe, imfuneko yezisombululo zokupakisha ezinokuthenjwa nezichanekileyo iya kuhlala inamandla kumacandelo abathengi, amashishini, kunye neemoto.
Ixesha lokuthumela: Matshi-02-2026