Ishishini letshiphu yeemoto liqhuba utshintsho
Kutshanje, iqela lobunjineli be-semiconductor lixoxe ngeetshiphusi ezincinci, i-hybrid bonding, kunye nezixhobo ezitsha kunye noMichael Kelly, uSekela Mongameli we-chip encinci ye-Amkor kunye nokuhlanganiswa kweFCBGA. Kwakhona ukuthatha inxaxheba kwingxoxo yayingumphandi we-ASE uWilliam Chen, i-CEO yePromex Industries uDick Otte, kunye noSander Roosendaal, uMlawuli we-R & D we-Synopsys Photonics Solutions. Ngezantsi kukho izicatshulwa zale ngxoxo.
Kwiminyaka emininzi, ukuphuhliswa kwee-chips zeemoto akuzange kuthathe indawo ehamba phambili kwishishini. Nangona kunjalo, ngokunyuka kwezithuthi zombane kunye nokuphuhliswa kweenkqubo ze-infotainment eziphambili, le meko ishintshile kakhulu. Yeyiphi imiba oyiqapheleyo?
I-Kelly: I-ADAS ephezulu (i-Advanced Driver Assistance Systems) ifuna iiprosesa ezinenkqubo ye-5-nanometer okanye encinci ukuba ikhuphisane kwiimarike. Emva kokuba ungene kwinkqubo ye-5-nanometer, kufuneka uqwalasele iindleko ze-wafer, ezikhokelela ekuqwalaseleni ngokucokisekileyo izisombululo ze-chip ezincinci, njengoko kunzima ukwenza ii-chips ezinkulu kwinkqubo ye-5-nanometer. Ukongeza, isivuno siphantsi, okukhokelela kwiindleko eziphezulu kakhulu. Xa ujongene ne-5-nanometer okanye iinkqubo eziphambili, abathengi bacinga ngokukhetha inxalenye ye-5-nanometer chip kunokusebenzisa i-chip yonke, ngelixa ukwandisa utyalo-mali kwinqanaba lokupakisha. Basenokucinga ukuba, "Ngaba kuya kuba yinto engabizi kakhulu ukufezekisa ukusebenza okufunekayo ngale ndlela, kunokuba uzame ukugqiba yonke imisebenzi kwi-chip enkulu?" Ke, ewe, iinkampani zeemoto eziphakamileyo ngokuqinisekileyo zinika ingqalelo kubuchwephesha obuncinci be-chip. Iinkampani eziphambili kushishino zikubeka esweni oku. Xa kuthelekiswa necandelo le-computing, imboni yeemoto mhlawumbi i-2 kwiminyaka emi-4 emva kokusetyenziswa kwe-teknoloji ye-chip encinci, kodwa indlela yokusetyenziswa kwayo kwicandelo lezemoto icacile. Umzi-mveliso weemoto uneemfuno zokuthembeka eziphezulu kakhulu, ngoko ke ukuthembeka kweteknoloji yetshiphu encinci kufuneka kungqinwe. Nangona kunjalo, usetyenziso olukhulu lwetekhnoloji encinci ye-chip kwintsimi yeemoto ngokuqinisekileyo isendleleni.
UChen: khange ndiphawule imiqobo ebalulekileyo. Ndicinga ukuba kuninzi malunga nokufuna ukufunda kunye nokuqonda iimfuno ezifanelekileyo zesatifikethi nzulu. Oku kubuyela kwinqanaba le-metrology. Sizenza njani iipakethe ezihlangabezana nemigangatho engqongqo yemoto? Kodwa ngokuqinisekileyo itekhnoloji efanelekileyo iyaqhubeka ivela.
Ukunikezelwa kwemiba emininzi ye-thermal kunye nobunzima obunxulumene namacandelo amaninzi, ngaba kuya kubakho iiprofayili zovavanyo olutsha loxinzelelo okanye iintlobo ezahlukeneyo zovavanyo? Ngaba imigangatho yangoku yeJEDEC ingagubungela ezo nkqubo zidibeneyo?
U-Chen: Ndiyakholelwa ukuba kufuneka siphuhlise iindlela zokuxilonga ezibanzi ngakumbi ukuchonga ngokucacileyo umthombo wokungaphumeleli. Siye saxoxa ngokudibanisa i-metrology kunye ne-diagnostics, kwaye sinoxanduva lokuqonda indlela yokwakha iipakethe ezinamandla ngakumbi, ukusebenzisa izixhobo ezikumgangatho ophezulu kunye neenkqubo, kunye nokuziqinisekisa.
UKelly: Namhlanje, senza izifundo zecala kunye nabathengi, abaye bafunda into ethile kwi-system-level test, ngakumbi uvavanyo lwefuthe lokushisa kwiimvavanyo zebhodi ezisebenzayo, ezingabandakanywanga kuvavanyo lwe-JEDEC. Uvavanyo lwe-JEDEC luvavanyo nje lwe-isothermal, olubandakanya "ukunyuka kobushushu, ukuwa, kunye nokutshintsha kobushushu." Nangona kunjalo, ukuhanjiswa kwamaqondo obushushu kwiiphakheji zokwenyani kukude kwinto eyenzekayo kwihlabathi lokwenyani. Bayanda abathengi abafuna ukwenza uvavanyo lwenqanaba lenkqubo kwangoko kuba bayayiqonda le meko, nangona ingenguye wonke umntu oyaziyo. Itekhnoloji yokulinganisa nayo idlala indima apha. Ukuba umntu unesakhono kwi-thermal-mechanical dilation simulation, ukuhlalutya iingxaki kuba lula kuba bayazi ukuba zeziphi iinkalo ekufuneka zigxininise kuzo ngexesha lovavanyo. Uvavanyo lwenqanaba lenkqubo kunye neteknoloji yokulinganisa iyancedisana. Nangona kunjalo, lo mkhwa usekwinqanaba lawo lokuqala.
Ngaba kukho imiba eshushu yokujongana netekhnoloji esele ikhulile kunangaphambili?
UOtte: Ewe, kodwa kule minyaka imbalwa idlulileyo, imiba ye-coplanarity iye yanda kakhulu. Sibona i-5,000 ukuya kwi-10,000 iintsika zethusi kwi-chip, ihlukaniswe phakathi kwe-50 microns kunye ne-127 microns ngaphandle. Ukuba uhlolisisa ngokusondeleyo idatha echaphazelekayo, uya kufumanisa ukuba ukubeka ezi ntsika zobhedu kwi-substrate kunye nokwenza imisebenzi yokufudumeza, ukupholisa, kunye ne-reflow soldering kufuna ukufezekisa malunga nenxalenye enye kwi-coplanarity precision eyikhulu lamawaka. Inxalenye enye ekuchanekeni kwekhulu lamawaka ifana nokufumana ingca yengca kubude bebala lebhola. Sithenge izixhobo eziphezulu zokusebenza kwe-Keyence ukulinganisa i-flatness ye-chip kunye ne-substrate. Ngokuqinisekileyo, umbuzo olandelayo ngowokulawula njani le nto yokulwa ngexesha lokujikeleza kwe-reflow soldering? Lo ngumba ocinezelayo ekufuneka usonjululwe.
U-Chen: Ndikhumbula iingxoxo malunga nePonte Vecchio, apho basebenzise i-solder ephantsi kweqondo lokushisa kwingqwalasela yendibano kunezizathu zokusebenza.
Ngenxa yokuba zonke iisekethe ezikufutshane zisenemiba ye-thermal, ifotonics kufuneka idityaniswe njani kule nto?
Roosendaal: Ukulinganisa kwe-Thermal kufuneka kuqhutywe kuzo zonke iinkalo, kunye nokukhutshwa kwe-high-frequency extraction nayo iyimfuneko kuba iimpawu ezingenayo ziyimpawu eziphezulu ze-frequency. Ke ngoko, imiba efana nokudibana kwe-impedance kunye nokubekwa komhlaba okufanelekileyo kufuneka kuqwalaselwe. Kunokubakho iqondo lobushushu elibalulekileyo, elinokuthi libekho ngaphakathi kwifa ngokwayo okanye phakathi kwento esiyibiza ngokuba yi "E" die (ukufa kombane) kunye ne "P" die (photon die). Ndinomdla wokwazi ukuba kufuneka singene nzulu kwiimpawu ze-thermal zokuncamathelisa.
Oku kuphakamisa iingxoxo malunga nezixhobo zokudibanisa, ukukhetha kwazo, kunye nokuzinza ekuhambeni kwexesha. Kuyabonakala ukuba itekhnoloji ye-hybrid bonding isetyenzisiwe kwihlabathi lokwenyani, kodwa ayikasetyenziselwa imveliso yobuninzi. Ithini imeko yangoku yobu buchwepheshe?
UKelly: Onke amaqela akwikhonkco lokubonelela anikela ingqalelo kwitekhnoloji ye-hybrid bonding. Okwangoku, le teknoloji ikhokelwa ikakhulu ngabasunguli, kodwa i-OSAT (i-Outsourced Semiconductor Assembly kunye noVavanyo) iinkampani nazo zifunda ngokunzulu izicelo zayo zorhwebo. Amacandelo e-Classic copper hybrid dielectric bonding aye afumana ukuqinisekiswa kwexesha elide. Ukuba ucoceko lunokulawulwa, le nkqubo inokuvelisa amacandelo omelele kakhulu. Nangona kunjalo, ineemfuno zococeko eziphezulu kakhulu, kwaye iindleko zezixhobo ezinkulu ziphezulu kakhulu. Siye safumana iinzame zokusetyenziswa kwangoko kumgca wemveliso we-AMD we-Ryzen, apho uninzi lwe-SRAM lwalusebenzisa itekhnoloji yokudibanisa ubhedu. Nangona kunjalo, khange ndibone abanye abathengi abaninzi besebenzisa le teknoloji. Nangona ikwimephu yendlela yetekhnoloji yeenkampani ezininzi, kubonakala ngathi kuyakuthatha iminyaka embalwa eyongezelelweyo ukuba izixhobo ezihambelanayo zihlangabezane neemfuno zococeko ezizimeleyo. Ukuba inokufakwa kwindawo yefektri enococeko oluphantsi kancinci kunelaphu elisicaba eliqhelekileyo, kwaye ukuba iindleko eziphantsi zinokufezekiswa, mhlawumbi le teknoloji iya kufumana ingqalelo engakumbi.
I-Chen: Ngokwezibalo zam, ubuncinane amaphepha e-37 kwi-hybrid bonding iya kuhanjiswa kwinkomfa ye-ECTC ye-2024. Le yinkqubo efuna ubuchule obuninzi kwaye ibandakanya inani elibalulekileyo lemisebenzi emihle ngexesha lendibano. Ke le teknoloji ngokuqinisekileyo iya kubona ukusetyenziswa ngokubanzi. Sele kukho ezinye iimeko zesicelo, kodwa kwixesha elizayo, iya kuxhaphaka ngakumbi kwiindawo ezahlukeneyo.
Xa ukhankanya "imisebenzi emihle," ngaba ubhekisa kwimfuno yotyalo-mali olubalulekileyo?
UChen: Ewe, kubandakanya ixesha kunye nobuchule. Ukwenza lo msebenzi kufuna indawo ecocekileyo kakhulu, efuna utyalo-mali lwemali. Ikwafuna izixhobo ezinxulumeneyo, ezifuna ngokufanayo inkxaso-mali. Ngoko oku akubandakanyi iindleko zokusebenza kuphela kodwa notyalo-mali kumaziko.
Kelly: Kwiimeko ezinesithuba seemicrons ezili-15 okanye ngaphezulu, kukho umdla obalulekileyo wokusebenzisa icopper wafer-to-wafer technology. Ngokufanelekileyo, ii-wafers zithe tyaba, kwaye iisayizi zetshiphu azikho zikhulu kakhulu, zivumela ukuphinda kuqhutyekwe kwinqanaba eliphezulu kwezinye zezi zithuba. Ngelixa oku kuzisa imiceli mngeni ethile, kubiza kakhulu kunokuzinikela kwitekhnoloji yokudibanisa ubhedu. Nangona kunjalo, ukuba imfuno echanekileyo yi-10 microns okanye iphantsi, imeko iyatshintsha. Iinkampani ezisebenzisa iteknoloji yokupakisha i-chip ziya kufezekisa izithuba ze-micron ezinedijithi enye, ezifana ne-4 okanye i-5 microns, kwaye akukho ndlela yimbi. Ke ngoko, itekhnoloji efanelekileyo iya kuphuhlisa ngokuqinisekileyo. Nangona kunjalo, itekhnoloji esele ikho nayo iyaphucuka ngokuqhubekayo. Ke ngoku sigxininise kwimida apho iintsika zobhedu zinokuyandisa kwaye ingaba le teknoloji iya kuhlala ixesha elide ngokwaneleyo ukuba abathengi babambezele lonke uyilo kunye "nesiqinisekiso" sotyalo-mali lophuhliso kwitekhnoloji ye-copper hybrid bonding.
U-Chen: Siya kwamkela kuphela itekhnoloji efanelekileyo xa kukho imfuno.
Ngaba luninzi uphuhliso olutsha kwindawo yokubumba i-epoxy ngoku?
UKelly: Iikhompawundi zokubumba ziye zatshintsha kakhulu. I-CTE yabo (i-coefficient yokwandiswa kwe-thermal) iyancipha kakhulu, ibenze bathandeke ngakumbi kwizicelo ezifanelekileyo ukusuka kumbono woxinzelelo.
Otte: Ukubuyela kwingxoxo yethu yangaphambili, zingaphi iitshiphusi ze-semiconductor ezenziwe ngoku nge-1 okanye i-2 micron isithuba?
UKelly: Umlinganiselo obalulekileyo.
Chen: Mhlawumbi ngaphantsi kwe-1%.
Otte: Ke itekhnoloji esiyixoxayo ayisiyonto eqhelekileyo. Ayikho kwinqanaba lophando, njengoko iinkampani ezikhokelayo zisebenzisa le teknoloji, kodwa zibiza kwaye zinezivuno eziphantsi.
UKelly: Oku kusetyenziswa ikakhulu kwikhompyuter esebenza kakhulu. Kule mihla, ayisetyenziswanga kuphela kumaziko edatha kodwa nakwiiPC eziphezulu kunye nezinye izixhobo eziphathwa ngesandla. Nangona ezi zixhobo zincinci, zisenomsebenzi ophezulu. Nangona kunjalo, kumxholo obanzi weprosesa kunye nezicelo zeCMOS, ubungakanani bayo buhlala buncinci. Kubavelisi be-chip abaqhelekileyo, akukho mfuneko yokwamkela le teknoloji.
Otte: Yiyo loo nto imangalisa ukubona obu buchwepheshe bungena kwishishini leemoto. Iimoto azifuni iitshiphusi ukuba zibe zincinci kakhulu. Bangakwazi ukuhlala kwiinkqubo ze-nanometer ze-20 okanye ze-40, njengoko iindleko ze-transistor kwi-semiconductors ziphantsi kakhulu kule nkqubo.
Kelly: Nangona kunjalo, iimfuno zokubala ze-ADAS okanye ukuqhuba ngokuzimeleyo ziyafana nezo zeePC ze-AI okanye izixhobo ezifanayo. Ke ngoko, umzi-mveliso weemoto kufuneka utyale imali kwezi teknoloji ziphambili.
Ukuba umjikelo wemveliso yiminyaka emihlanu, ngaba ukwamkela itekhnoloji entsha kungalwandisa uncedo lweminye iminyaka emihlanu?
UKelly: Yingongoma esengqiqweni leyo. Ishishini leemoto linenye i-engile. Cinga ngabalawuli be-servo abalula okanye izixhobo ze-analog ezilula eziye zahlala iminyaka engama-20 kwaye zinexabiso eliphantsi kakhulu. Basebenzisa iitshiphusi ezincinci. Abantu abakwishishini leemoto bafuna ukuqhubeka nokusebenzisa ezi mveliso. Bafuna ukutyala imali kwizixhobo zekhompyuter eziphezulu kakhulu ezineetshiphusi ezincinci zedijithali kwaye mhlawumbi zibhanqe neetshiphusi ze-analog zamaxabiso aphantsi, inkumbulo ekhanyayo, kunye neetshiphusi zeRF. Kubo, imodeli ye-chip encinci yenza ingqiqo eninzi kuba inokugcina amaninzi aphantsi, azinzileyo, amacandelo esizukulwana esidala. Abafuni kutshintsha la malungu kwaye abafuni kutshintsha. Emva koko, bafuna nje ukongeza i-5-nanometer ephezulu okanye i-3-nanometer encinci ye-chip ukuzalisekisa imisebenzi yecandelo le-ADAS. Ngapha koko, basebenzisa iintlobo ezahlukeneyo zeetshiphusi ezincinci kwimveliso enye. Ngokungafaniyo nePC kunye neendawo zekhompyuter, ishishini leemoto linoluhlu oluhlukeneyo lwezicelo.
U-Chen: Ngaphezu koko, ezi chips akufuneki zifakwe ecaleni kwe-injini, ngoko ke iimeko zokusingqongileyo zingcono kakhulu.
UKelly: Iqondo lobushushu lokusingqongileyo ezimotweni liphezulu kakhulu. Ngoko ke, nokuba amandla e-chip akaphakamanga kakhulu, ishishini leemoto kufuneka lityale imali ethile kwizisombululo zolawulo lwe-thermal kwaye linokucinga ukusebenzisa i-indium TIM (izinto zokusebenzela umbane) kuba iimeko zokusingqongileyo zinzima kakhulu.
Ixesha lokuposa: Apr-28-2025