Ukupakishwa kwe-semiconductorcring ivele kwi-PCB ye-PCB ye-PCB ye-1D ukusika-umqolo we-3D hybrid kwindawo enesidima. Oku kuhambela phambili kuvumela i-Spacinaction kwi-Pisconnection kwimigca ye-Micron ye-microron enye, kunye neebhendi ukuya kuthi ga kwi-1000 GB / s, ngelixa ugcina ukusebenza kakuhle kwamandla. Kwisiseko setekhnoloji ye-semiconductor ye-SEEMIOnductor yi-2.5D ukupakisha (apho kufakwe khona amacandelo ecaleni kwendlela yomlimi) kunye nokupakishwa kwe-3D Ezi teknoloji zibalulekile kwikamva leenkqubo ze-HPC.
Itekhnoloji yokupakisha iquka izixhobo ezahlukeneyo zabalinganiswa, nganye inezibonelelo zayo kunye nezinto ezingalunganga. I-Silicon (i-SI) ye-Silicon (i-SI), kubandakanya izakhiwo ze-silicon ze-silicon kunye neebhulorho zasekhaya, ziyaziwa ngokubonelela ngezakhono ezigqibeleleyo ze-wiric, zisenza ukuba zilungele i-Compsm yokusebenza ephezulu. Nangona kunjalo, ziindleko ngokwezixhobo kunye nemveliso kunye nokujongana nemida kwingingqi yepaki. Ukunciphisa le micimbi, ukusetyenziswa kweebhulorho zasekhaya ze-selicon kuyanda, ukusebenzisa ubuchule besi-selicon apho ukusebenza kakuhle kubalulekile ngelixa ijongana neengxaki zendawo.
IiNdawo eziPhezulu zoLuntu, zisebenzisa i-fan-yokutsalwa kwePlastics, yindlela esebenzayo ngakumbi kwi-silicon. Banendawo esezantsi yediliya, enciphisa ukulibaziseka kwe-RC kwiphakheji. Ngaphandle kwezi zinto ziluncedo, iimpawu ze-opticy ze-ontermicles zizabalazela ukufikelela kwinqanaba elifanayo lokuncitshiswa kwenqaku leSilika, ukunciphisa umda wokuthatha umntwana ongamzalanga abe ngowakho.
Iimpawu zeglasi zinemidla ebaluleke kakhulu, ngakumbi ukulandela ukuqaliswa kwe-Intel kwiPakethi yeZithuthi ezisekwe kwiGlasi. Iglasi inika izibonelelo ezininzi, ezinje ngokulandelelana okuguqulwayo (i-CTE), ukuzinza okuphezulu kunye nokuxhasa umgqatswa wepaneli, ibethe tyaba, kwaye ithe tyaba, kunye nenqanaba elithenjisiweyo le-wiricon. Nangona kunjalo, ngaphandle kwemiceli mngeni yezobugcisa, owona mthwalo uphambili kweglasi yeglasi yinkqubo ye-ecosystem kunye nokunqongophala okukhulu komgangatho omkhulu. Njengoko i-ecosystem yoqoqosho kunye nemveliso yemveliso iphucula, itekhnoloji esekwe kwiGlasi kwi-semiconductor yephakheji inokubona ukukhula okuthe kratya nokwamkelwa.
Ngokwe-tekhnoloji yephakethe ye-3D, i-CU-Cump-i-Hybrid ye-hybrid iba yitekhnoloji ekhuthazayo. Olu chwephesha ophumeleleyo lufumana unxibelelwano olusisigxina ngokudibanisa izinto zeDeecric (njengeSio2) ngeentsimbi ezifakelweyo (Cu). I-CU-CU HAHRINGRD inokufumana indawo engezantsi kwe-10 microns, ifanekisela ukuphuculwa kwe-micron, emele ukuphuculwa kwetekhnoloji yemveli enama-40-50. Iinzuzo zokubonda kwe-hybrid zibandakanya i-I / O, ephuculweyo ye-Bandwidth, ephuculweyo ye-3D ethe nkqo, kwaye iphumelele amandla, kwaye inciphise iziphumo zeparasitic kunye nokungaxhathisi ubugqwirha ngenxa yokungabikho kokugcwala kwe-parma. Nangona kunjalo, le teknoloji inzima ukwenziwa kwaye inendleko eziphezulu.
2.5D kunye neetekhnoloji zephakheji ze-3D ziquka iindlela ezahlukeneyo zokungena. Kwi-2.5D ukupakisha, kuxhomekeka ekukhetheni kwezinto ezikhethwayo zohlobo lomgangatho, zinokwahlulwa ekubeni zizilumkiso ezisekwe kwi-silicon, ezisekwe kwiGrantic, kunye neGlasi, njengoko kubonisiwe kumzobo ongentla. Kwipakethi ye-3D, ukuphuculwa kwetekhnoloji ye-Micro-Bump ijolise ekunciphiseni ubungakanani bendawo yokuhlala, kodwa namhlanje, ngokuthatha iteknoloji ye-Hu-Curad ye-Hu-CU
** Iindlela eziphambili zetekhnoloji ukubukela: **
1. ** Iindawo ezinkulu zodidi lomsebenzi: I-Tsmc nguMboneleli ophambili we-2.5D Silicon Labemi baseNvidia kunye nabanye abaphuhlisi be-HPC enjengeGoogle kunye neAmazon, kwaye inkampani isandula ukubhengeza ukuveliswa kwesixa se-COWSES. I-Idtechex ilindele le meko ukuze iqhubeke, ngenkqubela phambili ngakumbi ekuxoxwe ngayo kwingxelo yayo egubungela abadlali abaphambili.
2. ** Ukupakisha umgangatho wepaneli: Le ndlela yokupakisha ivumela ukusetyenziswa kweendlela ezinkulu ezinobuchule kwaye zinceda ukunciphisa iindleko ngokuvelisa iipakethi ezininzi ngaxeshanye. Ngaphandle kokunokwenzeka, imiceli mngeni efana nolawulo lwemfazwe lusafuneka lujongiwe. Ukonyuka kwayo kubonakalisa isidingo esikhulayo sezinto ezinkulu ezinamandla, ezinobuchule obunamandla.
3. Iimboniselo zeglasi ziyahambelana nokupakisha umgangatho wephaneli, ukuhambisa amandla e-wirity ephezulu ye-wirity kwiindleko ezilawulekayo, ezenza isisombululo esithembisayo kubuchwephesha bexesha elizayo.
I-4. Itekhnoloji isetyenzisiwe kwiimveliso ezahlukeneyo zeseva eziphezulu, kubandakanya i-AMD CAPCC ye-SMRC enamanzi kunye ne-CPU, kunye nochungechunge lwe-MI300 lokuhlawula iibhloko ze-CPU / GPU kwi-I / O I-hybrid boung kulindeleke ukuba idlale indima ebaluleke kakhulu kwinkqubela phambili ye-HBM yexesha elizayo, ngakumbi i-Dram Stacks ngaphezulu kwe-16-hi okanye ama-20-Hood okanye i-20.
I-5. Izixhobo ze-CO-zipakishwe izixhobo (CPO) zisisisombululo esiphambili sokukhulisa i / o bandwidth kunye nokunciphisa ukusetyenziswa kwamandla. Xa kuthelekiswa nosulelo lombane ngokwesiko, unxibelelwano olunjani lubonelela ngeenzuzo ezininzi, kubandakanya i-Atting Stovel Study ngaphezulu komgama omde, unciphise imvakalelo ye-crossstalk, kwaye yanyusa kakhulu i-bandwidth. Ezi zibonelelo zenza i-CPO luhlobo olufanelekileyo lweenkqubo ezinobuchule be-HPC.
** Iimarike eziphambili zokubukela: **
Imakethi ephambili yokuqhuba uphuhliso lwe-2.5D kunye neetekhnoloji zephakheji ze-3D ngokungathandabuzekiyo Ezi ndlela zokupakisha okuphambili zibalulekile ukoyisa imiqobo yomthetho ka-Moore, enika amandla okungaphezulu, inkumbulo, kunye nokunxibelelana ngaphakathi kwephakeji enye. Ukubola kwee-chips ze-chips kuyavumela ukusetyenziswa ngokugqibeleleyo kweendawo ezisebenza kuzo eziphakathi kweebhloko ezahlukeneyo, ezinjengokwahlula iibhloko ze-I / O ukuya kwiibhloko zokuqhubela phambili.
Ukongeza kwi-Compling ephezulu yokusebenza (i-HPC), ezinye iimarike nazo kulindeleke ukuba zifezekise ukukhula ngokwamkelwa malunga netekhnoloji yokupakisha. Kumacandelo angama-5g kunye ne-6G, i-Invouts enjengokufaka i-ententenas kunye nezisombululo ze-chip ezisika i-chip ziya kudala ikamva lenethiwekhi ye-wireless yenethiwekhi (i-Run). Izithuthi ezizezimeleyo ziya kuxhamla, njengoko ezi teknoloji zixhasa ukudityaniswa kwamachibi kunye neeyunithi zokwenza i-lers ukwenza idatha enkulu ngelixa iqinisekisa ukhuseleko, ukuxhomekeka, kunye nokusebenza kwexabiso.
I-elektroniki kubathengi (kubandakanya i-smartphones, i-smartwatches, izixhobo ze-AR / VR, kunye neePC, kunye nokusebenza) kuyagxila ekuqhubekeni kwedatha ezincinci, nangona kugxininiswa ngakumbi kwiindleko. Iphakheji ye-semiconduct ye-semiconductor iyadlala indima ephambili kule meko, nangona iindlela zokupakisha zinokwahluka kwezi zisetyenziswa kwi-HPC.
IXESHA LOKUQALA: I-Oct-07-2024