Ukupakishwa kweSemiconductor kuye kwavela kuyilo lwe-1D PCB yemveli ukuya kungqameko lwe-3D yokudibanisa i-hybrid kwinqanaba le-wafer. Le nkqubela phambili ivumela isithuba soqhagamshelwano kuluhlu lwemicron enedijithi enye, kunye ne-bandwidths ukuya kuthi ga kwi-1000 GB/s, ngelixa kugcinwa ukusebenza kakuhle kwamandla. Embindini wetekhnoloji yokupakisha ye-semiconductor ephucukileyo kukupakishwa kwe-2.5D (apho amacandelo abekwe ecaleni kwinqanaba eliphakathi) kunye nokupakishwa kwe-3D (okubandakanya ukupakisha ngokuthe nkqo iitshiphusi ezisebenzayo). Ezi teknoloji zibalulekile kwikamva leenkqubo ze-HPC.
Itekhnoloji yokupakisha ye-2.5D ibandakanya izixhobo ezahlukeneyo zomaleko ophakathi, nganye ineengenelo zayo kunye nokungalunganga. I-Silicon (Si) i-intermediary layers, kubandakanywa ii-wafers ze-silicon ezipheleleyo kunye neebhulorho ze-silicon zasekhaya, zaziwa ngokubonelela ngezona zakhono zocingo zigqwesileyo, zizenza zilungele ukusebenza okuphezulu kwekhompyuter. Nangona kunjalo, zibiza kakhulu ngokwemathiriyeli kunye nokuveliswa kunye nokulinganiselwa kobuso kwindawo yokupakisha. Ukunciphisa le miba, ukusetyenziswa kweebhulorho ze-silicon zasekhaya kuyanda, kusetyenziswa isilicon apho ukusebenza kakuhle kubaluleke kakhulu ngelixa kulungiswa imiqobo yendawo.
Iileya ze-Organic intermediary, zisebenzisa iiplastiki ezibunjiweyo zefeni, ziyindlela engabizi kakhulu kune-silicon. Banomlinganiselo ophantsi we-dielectric, onciphisa ukulibaziseka kweRC kwiphakheji. Ngaphandle kwezi nzuzo, i-organic intermediary layers iyasokola ukufikelela kwinqanaba elifanayo lokuncitshiswa kwesici sonxibelelwano njenge-silicon-based packaging, ukunciphisa ukwamkelwa kwabo kwizicelo zekhompyuter ezisebenza kakhulu.
Izaleko zeglasi zomlamli zifumene umdla obalulekileyo, ngakumbi emva kokuqaliswa kwe-Intel yamva nje yokupakishwa kwemoto yovavanyo olusekwe kwiglasi. Iglasi ibonelela ngeengenelo ezininzi, ezinje nge-coefficient ehlengahlengiswayo yokwandiswa kwe-thermal (CTE), uzinzo oluphezulu lwe-dimensional, umphezulu ogudileyo kunye nosicaba, kunye nokukwazi ukuxhasa ukwenziwa kweephaneli, kuyenza ibe ngumgqatswa othembisayo kumaleko aphakathi anamandla ocingo anokuthelekiswa nesilicon. Nangona kunjalo, ngaphandle kwemiceli mngeni yobugcisa, eyona ntsilelo iphambili yomaleko weglasi ophakathi yinkqubo yendalo engekavuthwa kunye nokungabikho kwangoku komthamo omkhulu wemveliso. Njengoko i-ecosystem ikhula kunye namandla emveliso ephucuka, itekhnoloji esekwe kwiglasi kwipakethe ye-semiconductor inokubona ukukhula ngakumbi kunye nokwamkelwa.
Ngokubhekiselele kwitekhnoloji yokupakisha ye-3D, i-Cu-Cu bump-less hybrid bonding iba yeyona teknoloji iphambili. Ubuchwephesha obuphambili bufezekisa ukudibanisa okusisigxina ngokudibanisa izinto ze-dielectric (ezifana ne-SiO2) kunye neentsimbi ezifakwe ngaphakathi (Cu). I-Cu-Cu hybrid bonding inokufikelela kwizithuba ezingaphantsi kwe-10 microns, ngokuqhelekileyo kuluhlu lwe-micron enedijithi enye, emele uphuculo olubonakalayo kwi-teknoloji ye-micro-bump yendabuko, ene-bump spacings malunga ne-40-50 microns. Iingenelo ze-hybrid bonding zibandakanya ukunyuka kwe-I / O, i-bandwidth ephuculweyo, ukuphuculwa kwe-3D ukupakishwa ngokuthe nkqo, ukusebenza kakuhle kwamandla, kunye nokunciphisa imiphumo ye-parasitic kunye nokuxhatshazwa kwe-thermal ngenxa yokungabikho kokuzaliswa kwezantsi. Nangona kunjalo, le teknoloji inzima ukwenza kwaye ineendleko eziphezulu.
I-2.5D kunye ne-3D iteknoloji yokupakisha iquka iindlela ezahlukeneyo zokupakisha. Kwi-packaging ye-2.5D, kuxhomekeke ekukhethweni kwezinto zomaleko ophakathi, inokuthi ihlelwe kwi-silicon-based, i-organic-based, kunye ne-glass-based intermediary layers, njengoko kuboniswe kumzobo ongentla. Kwipakethe ye-3D, uphuhliso lwetekhnoloji ye-micro-bump ijolise ekunciphiseni imilinganiselo yesithuba, kodwa namhlanje, ngokwamkela iteknoloji ye-hybrid bonding (indlela yokudibanisa ye-Cu-Cu ngqo), imilinganiselo yedijithi enye inokufezekiswa, iphawula inkqubela phambili ebalulekileyo kwintsimi. .
**IiNdlela zeTekhnoloji eziPhambili zokujongwa:**
1. **IiNdawo zoMaleko oMphakathi oMkhulu:** I-IDTechEx yaxela kwangaphambili ukuba ngenxa yobunzima bomaleko we-silicon ophakathi odlula umda we-3x we-reticle ubungakanani, izisombululo zebhulorho ye-silicon ye-2.5D kungekudala ziya kuthatha indawo ye-silicon ephakathi njengokhetho oluphambili lokupakisha iitshiphusi ze-HPC. I-TSMC ngumboneleli ophambili we-2.5D ye-silicon ephakathi kwe-NVIDIA kunye nabanye abaphuhlisi abaphambili be-HPC abanjengoGoogle kunye ne-Amazon, kwaye inkampani isandula ukubhengeza ukuveliswa kobuninzi besizukulwana sayo sokuqala i-CoWoS_L enesayizi ye-3.5x ye-reticle. I-IDTechEx ilindele ukuba lo mkhwa uqhubeke, kunye nenkqubela phambili exoxwe kwingxelo yayo ebandakanya abadlali abakhulu.
2. **Ukupakishwa kweNqanaba lePhaneli:** Ukupakishwa kwenqanaba lephaneli kuye kwaba yingqwalasela ebalulekileyo, njengoko kugxininiswe kwi-2024 Taiwan International Semiconductor Exhibition. Le ndlela yokupakisha ivumela ukusetyenziswa kweeleyile ezinkulu zomlamli kwaye inceda ukunciphisa iindleko ngokuvelisa iipakethe ezininzi ngaxeshanye. Nangona inako, imingeni efana nolawulo lwe-warpage kusafuneka iqwalaselwe. Ukubalasela kwayo okwandayo kubonisa imfuno ekhulayo yeeleya ezinkulu, ezingabizi kakhulu.
3. **I-Glass Intermediary Layers:** I-Glass ivela njengesixhobo esomeleleyo somviwa wokuphumeza i-wireing entle, ethelekiseka ne-silicon, eneenzuzo ezongezelelweyo ezifana ne-CTE enokuhlengahlengiswa kunye nokuthembeka okuphezulu. Iileya zeGlas eziphakathi nazo ziyahambelana nokupakishwa kwenqanaba lephaneli, ezibonelela ngokunokwenzeka kocingo olunoxinaniso oluphezulu ngeendleko ezilawulekayo, oko kuyenza ibe sisisombululo esithembisayo sobuchule bokupakisha bexesha elizayo.
4. **I-HBM Hybrid Bonding:** I-3D ye-copper-copper (Cu-Cu) i-hybrid bonding yiteknoloji ephambili yokufezekisa i-ultra-fine pitch vertical interconnections phakathi kwee-chips. Le teknoloji isetyenziswe kwiimveliso ezahlukeneyo zeseva eziphezulu, kuquka i-AMD EPYC ye-SRAM egciniweyo kunye ne-CPUs, kunye nochungechunge lwe-MI300 lokupakisha iibhloko ze-CPU / GPU kwi-I / O ifa. Ukudibana kweHybrid kulindeleke ukuba kudlale indima ebalulekileyo kwinkqubela phambili ye-HBM yexesha elizayo, ngakumbi kwizitaki ze-DRAM ezidlula i-16-Hi okanye i-20-Hi umaleko.
5. **Ii-Co-Packaged Optical Devices (CPO):** Ngemfuno ekhulayo yokusetyenziswa kwedatha ephezulu kunye nokusebenza kakuhle kwamandla, iteknoloji ye-optical interconnect iye yafumana ingqwalasela enkulu. Izixhobo ze-optical co-packaged (CPO) ziba sisisombululo esibalulekileyo sokuphucula i-I / O bandwidth kunye nokunciphisa ukusetyenziswa kwamandla. Xa kuthelekiswa nokuhanjiswa kombane okuqhelekileyo, unxibelelwano lwe-optical lubonelela ngeenzuzo ezininzi, kubandakanya ukuthomalalisa umqondiso osezantsi kumgama omde, ukuncipha kobuntununtunu be-crosstalk, kunye nokwanda kwe-bandwidth. Ezi zibonelelo zenza i-CPO ibe lolona khetho lufanelekileyo kwiinkqubo ze-HPC ezinzulu, ezonga amandla.
**Iintengiso eziphambili ekufuneka uzibukele:**
Imakethi ephambili eqhuba uphuhliso lwe-2.5D kunye ne-3D teknoloji yokupakisha ngokungathandabuzekiyo icandelo le-high-performance computing (HPC). Ezi ndlela zokupakisha eziphambili zibalulekile ekoyiseni imida yoMthetho kaMoore, zenza ukuba ii-transistors ezininzi, inkumbulo, kunye noqhagamshelo ngaphakathi kwephakheji enye. Ukubola kwee-chips kukwavumela ukusetyenziswa ngokufanelekileyo kweendlela zenkqubo phakathi kweebhloko ezisebenzayo ezahlukeneyo, ezinjengokwahlula iibhloko ze-I/O kwiibhloko zokusetyenzwa, ngakumbi ukomeleza ukusebenza kakuhle.
Ukongeza kwi-high-performance computing (HPC), ezinye iimarike zikwalindeleke ukuba zifezekise ukukhula ngokwamkelwa kobuchwepheshe bokupakisha obuphambili. Kumacandelo e-5G kunye ne-6G, izinto ezintsha ezifana ne-antenna yokupakisha kunye nezisombululo ze-chips ezinqamlekileyo ziya kubumba ikusasa le-intanethi ye-wireless access network (RAN) architectures. Izithuthi ezizimeleyo ziya kuzuza kwakhona, njengoko obu buchwepheshe buxhasa ukuhlanganiswa kwee-sensor suites kunye neeyunithi zekhompyutha ukucubungula inani elikhulu ledatha ngelixa liqinisekisa ukhuseleko, ukuthembeka, ukuhambelana, amandla kunye nokulawulwa kwe-thermal, kunye neendleko-zokusebenza.
Ii-electronics zabathengi (kubandakanywa ii-smartphones, ii-smartwatches, izixhobo ze-AR / VR, ii-PC, kunye neendawo zokusebenza) zigxininisa ngakumbi ekuqhubeni idatha eninzi kwiindawo ezincinci, nangona kugxininiswa kakhulu kwiindleko. Ukupakishwa kwe-semiconductor ephezulu kuya kudlala indima ephambili kulo mkhwa, nangona iindlela zokupakisha zinokwahluka kwezo zisetyenziswe kwi-HPC.
Ixesha lokuposa: Oct-25-2024