Ukupakishwa kwe-semiconductor kuguquke ukusuka kuyilo lwe-PCB ye-1D yendabuko ukuya kwi-3D hybrid bonding yanamhlanje kwinqanaba le-wafer. Olu phuculo luvumela isithuba sokudibanisa kuluhlu lwe-micron yenombolo enye, kunye nee-bandwidths ezifikelela kwi-1000 GB/s, ngelixa kugcinwa ukusebenza kakuhle kwamandla. Kwisiseko setekhnoloji yokupakisha ye-semiconductor ephucukileyo kukho ukupakishwa kwe-2.5D (apho izinto zibekwe ecaleni komaleko ophakathi) kunye nokupakishwa kwe-3D (okubandakanya ukuqokelela iitships ezisebenzayo ngokuthe nkqo). Ezi teknoloji zibalulekile kwikamva leenkqubo ze-HPC.
Itekhnoloji yokupakisha ye-2.5D ibandakanya izixhobo ezahlukeneyo zomaleko ophakathi, nganye ineengenelo zayo kunye neengxaki zayo. Iimaleko zomaleko zeSilicon (Si), kuquka ii-wafer zesilicon ezingasebenziyo ngokupheleleyo kunye neebridge zesilicon ezikufutshane, zaziwa ngokubonelela ngezakhono zocingo ezilungileyo, ezenza ukuba zilungele ukusebenza kakuhle kwekhompyutha. Nangona kunjalo, zibiza kakhulu ngokwezixhobo kunye nokuveliswa kwaye zijongene nemida kwindawo yokupakisha. Ukunciphisa le micimbi, ukusetyenziswa kweebridge zesilicon ezikufutshane kuyanda, kusetyenziswa isilicon ngobuchule apho ukusebenza kakuhle kubalulekile ngelixa kujongwana nemida yendawo.
Iileya eziphakathi zendalo, ezisebenzisa iiplastiki ezibunjiweyo eziphuma kwifeni, ziyindlela engcono kakhulu kunesilicon. Zine-dielectric constant ephantsi, nto leyo enciphisa ukulibaziseka kwe-RC kwiphakheji. Nangona ezi zibonelelo, iileya eziphakathi zendalo ziyasokola ukufikelela kwinqanaba elifanayo lokunciphisa iimpawu zokudibanisa njengepakethe esekelwe kwisilicon, nto leyo ethintela ukwamkelwa kwazo kwizicelo zekhompyutha ezisebenzayo kakhulu.
Iileya zeglasi ezidibanisa iiglasi zifumene umdla omkhulu, ingakumbi emva kokuba i-Intel iqalise ukupakisha iimoto zovavanyo olusekelwe kwiglasi kutshanje. Iglasi inika iingenelo ezininzi, ezifana ne-adjustable coefficient of thermal expansion (CTE), uzinzo oluphezulu, iindawo ezigudileyo nezithe tyaba, kunye nokukwazi ukuxhasa ukwenziwa kweepaneli, okwenza ukuba ibe ngumviwa othembisayo kwiileya zeglasi ezinokukwazi ukuxhuma iintambo ezifana ne-silicon. Nangona kunjalo, ngaphandle kwemingeni yobuchwephesha, ingxaki ephambili yeeleya zeglasi ezidibanisa iiglasi kukungavuthwa kwenkqubo yendalo kunye nokungabikho kwamandla amakhulu emveliso okwangoku. Njengoko inkqubo yendalo ikhula kwaye amandla emveliso ephucuka, ubuchwepheshe obusekelwe kwiglasi ekupakisheni ii-semiconductor bunokubona ukukhula nokwamkelwa okungakumbi.
Ngokuphathelele ubuchwepheshe bokupakisha be-3D, i-Cu-Cu bump-less hybrid bonding iba yiteknoloji entsha ehamba phambili. Le ndlela iphambili ifezekisa unxibelelwano oluhlala luhleli ngokudibanisa izixhobo ze-dielectric (ezifana ne-SiO2) kunye neentsimbi ezifakwe ngaphakathi (Cu). I-Cu-Cu hybrid bonding inokufikelela kwiindawo ezingaphantsi kwe-10 microns, ngokuqhelekileyo kuluhlu lwe-single-digit micron, nto leyo ebonisa uphuculo olukhulu kuneteknoloji yendabuko ye-micro-bump, eneendawo ezinqamlezileyo ze-40-50 microns. Iingenelo ze-hybrid bonding ziquka ukwanda kwe-I/O, i-bandwidth ephuculweyo, ukuphuculwa kwe-3D vertical stacking, ukusebenza kakuhle kwamandla, kunye nemiphumo encitshisiweyo ye-parasitic kunye nokumelana nobushushu ngenxa yokungabikho kokuzaliswa kwezantsi. Nangona kunjalo, le teknoloji inzima ukuyenza kwaye ineendleko eziphezulu.
Iitekhnoloji zokupakisha ze-2.5D kunye ne-3D ziquka iindlela ezahlukeneyo zokupakisha. Kwipakethe ye-2.5D, kuxhomekeke ekukhethweni kwezinto zomaleko ophakathi, inokwahlulwahlulwa ibe ziileya eziphakathi ezisekwe kwi-silicon, ezisekwe kwi-organic, kunye nezisekwe kwiglasi, njengoko kubonisiwe kumfanekiso ongentla. Kwipakethe ye-3D, uphuhliso lwetekhnoloji ye-micro-bump lujolise ekunciphiseni ubukhulu besithuba, kodwa namhlanje, ngokwamkela itekhnoloji yokubopha ehlanganisiweyo (indlela yokudibanisa ngqo ye-Cu-Cu), ubukhulu besithuba sedijithi enye bunokufezekiswa, nto leyo ephawula inkqubela phambili ebalulekileyo kwicandelo.
**Iindlela Eziphambili Zobuchwepheshe Okufanele Uzibukele:**
1. **Iindawo ezinkulu zeLayer Intermediary:** IDTechEx ngaphambili yayixele kwangaphambili ukuba ngenxa yobunzima beeleya eziphakathi zesilicon ezidlula umda wobukhulu be-reticle obuyi-3x, izisombululo ze-silicon bridge eziyi-2.5D kungekudala ziza kuthatha indawo yeeleya eziphakathi zesilicon njengokhetho oluphambili lokupakisha iitships ze-HPC. I-TSMC ngumthengisi omkhulu weeleya eziphakathi ze-silicon eziyi-2.5D ze-NVIDIA kunye nabanye abaphuhlisi be-HPC abaphambili abanjengoGoogle kunye ne-Amazon, kwaye inkampani isandula ukubhengeza ukuveliswa okukhulu kweCoWoS_L yayo yesizukulwana sokuqala enobukhulu be-reticle obuyi-3.5x. IDTechEx ilindele ukuba olu hlobo luqhubeke, kunye nokuqhubela phambili okuxoxwe ngako kwingxelo yayo egubungela abadlali abaphambili.
2. **Ukupakisha Okukwinqanaba Lephaneli:** Ukupakisha okukwinqanaba lephaneli kube yinto ephambili, njengoko kuboniswe kwiMboniso ye-Taiwan International Semiconductor ka-2024. Le ndlela yokupakisha ivumela ukusetyenziswa kweeleya ezinkulu eziphakathi kwaye inceda ekunciphiseni iindleko ngokuvelisa iipakeji ezininzi ngaxeshanye. Nangona inamandla, imingeni efana nolawulo lwe-warpage isafuna ukujongwa. Ukwanda kokuqaqamba kwayo kubonisa imfuno ekhulayo yeeleya ezinkulu nezingabizi kakhulu eziphakathi.
3. **Iileyara Eziphakathi Zeglasi:** Iglasi ivela njengesixhobo esomeleleyo sokufikelela kwiintambo ezincinci, ezifana nesilicon, kunye neenzuzo ezongezelelweyo ezifana ne-CTE ehlengahlengiswayo kunye nokuthembeka okuphezulu. Iileyara eziphakathi zeglasi nazo ziyahambelana nokupakisha kwinqanaba lephaneli, zibonelela ngamathuba okufaka iintambo ezinoxinano oluphezulu ngeendleko ezilawulekayo, nto leyo eyenza ukuba ibe sisisombululo esithembisayo kwiiteknoloji zokupakisha zexesha elizayo.
4. **I-HBM Hybrid Bonding:** I-3D copper-copper bonding (Cu-Cu) hybrid bonding yiteknoloji ephambili yokufezekisa unxibelelwano oluthe tye phakathi kweetships. Le teknoloji isetyenzisiwe kwiimveliso ezahlukeneyo zeseva eziphezulu, kubandakanya i-AMD EPYC kwi-stacked SRAM kunye neeCPU, kunye nochungechunge lwe-MI300 lokufaka iibhloko ze-CPU/GPU kwi-I/O dies. I-hybrid bonding kulindeleke ukuba idlale indima ebalulekileyo ekuphuhlisweni kwe-HBM kwixesha elizayo, ngakumbi kwii-DRAM stacks ezidlula ii-16-Hi okanye ii-20-Hi layers.
5. **Izixhobo ze-Optical ezihlanganisiweyo (CPO):** Ngenxa yemfuno ekhulayo yokusetyenziswa kwedatha ephezulu kunye nokusebenza kakuhle kwamandla, iteknoloji yokunxibelelana kwe-optical ifumene ingqalelo enkulu. Izixhobo ze-optical ezihlanganisiweyo (CPO) ziba sisisombululo esiphambili sokuphucula i-bandwidth ye-I/O kunye nokunciphisa ukusetyenziswa kwamandla. Xa kuthelekiswa nothumelo lombane lwendabuko, unxibelelwano lwe-optical lubonelela ngeenzuzo ezininzi, kubandakanya ukuncitshiswa kwesignali okuncinci kumgama omde, ukuncipha kovakalelo lwe-crosstalk, kunye nokwanda kwe-bandwidth. Ezi nzuzo zenza i-CPO ibe lukhetho olufanelekileyo kwiinkqubo ze-HPC ezisebenzisa idatha eninzi, ezisebenzisa amandla amaninzi.
**Iimarike Eziphambili Okufanele Uzibukele:**
Imarike ephambili eqhuba uphuhliso lwetekhnoloji yokupakisha ye-2.5D kunye ne-3D ngokungathandabuzekiyo licandelo lekhompyutha esebenza kakuhle (i-HPC). Ezi ndlela zokupakisha eziphambili zibalulekile ekoyiseni imida yoMthetho kaMoore, zivumela ii-transistors ezingaphezulu, imemori, kunye nokunxibelelana ngaphakathi kwiphakheji enye. Ukuqhekeka kweetships kukwavumela ukusetyenziswa ngokugqibeleleyo kwee-process nodes phakathi kweebhloko ezahlukeneyo ezisebenzayo, njengokwahlula iibhloko ze-I/O kwiibhloko zokucubungula, nto leyo ephucula ngakumbi ukusebenza kakuhle.
Ukongeza kwi-high-performance computing (HPC), ezinye iimarike kulindeleke ukuba zikhule ngokwamkela ubuchwepheshe obuphambili bokupakisha. Kwicandelo le-5G kunye ne-6G, izinto ezintsha ezifana nee-antenna zokupakisha kunye nezisombululo ze-chip ezisemgangathweni ziya kuyila ikamva lezakhiwo zenethiwekhi yokufikelela engenazingcingo (i-RAN). Izithuthi ezizimeleyo nazo ziya kuxhamla, njengoko ezi teknoloji zixhasa ukuhlanganiswa kwee-sensor suites kunye neeyunithi zekhompyutha ukucubungula idatha eninzi ngelixa kuqinisekiswa ukhuseleko, ukuthembeka, ubuncinci, ulawulo lwamandla kunye nobushushu, kunye nokusebenza kakuhle kweendleko.
Izixhobo ze-elektroniki zabathengi (kuquka ii-smartphones, ii-smartwatches, izixhobo ze-AR/VR, iiPC, kunye neendawo zokusebenza) zigxile kakhulu ekucubunguleni idatha engaphezulu kwiindawo ezincinci, nangona kugxininiswa kakhulu kwixabiso. Ukupakisha kwe-semiconductor okuphucukileyo kuya kudlala indima ephambili kule ndlela, nangona iindlela zokupakisha zinokwahluka kwezo zisetyenziswa kwi-HPC.
Ixesha leposi: Okthobha-07-2024