Iindaba zeShishini: I-GPU iqhuba imfuno ye-silicon ye-sefirs

I-Silicon yeyona nto yesibini ixhaphakileyo emhlabeni, emva kweoksijini, kunye nesona sixhenxe siqhelekileyo kwindalo iphela. I-Silicon yi-semiconductor, intsingiselo ineepropathi yombane phakathi kwabathunywa (njengabakhali) kunye nezithintelo (njengeglasi). Isixa esincinci seeatom zangaphandle kwisilika esisiseko sinokuyitshintsha indlela yokuziphatha kwayo, ngoko ke ubunyulu be-semiconductor-bangan kufuneka bube phezulu. Ubuncinci obokolula obusezantsi kwebanga lesi-setrocn yi-79.9999%.

Oku kuthetha ukuba inye kuphela i-atom ye-silicon ivunyelwe kwiiathom ezilishumi ezilishumi. Amanzi okusela amahle avumela iimolekyuli ezingama-40 ezingezizo zamanzi, ezingama-50 amaxesha acocekileyo kune-semiconductor-yebanga lesilicon.

Abavelisi be-Silicon ye-Silicon ye-Silicon ye-Silicon bafanele baguqule i-silicdon ephezulu ibe yizakhiwo ezigqibeleleyo zekristali. Oku kwenziwa ngokuzisa ikristali yamama enye kwi-molten kwisilicon kwiqondo lobushushu elifanelekileyo. Njengoko intombi entsha yentombazana iqala ukukhula ijikeleze ikristale yomama, i-Silicon Iyot ineefom ezihamba kancinci ukusuka kwi-molten esilicon. Inkqubo iyacotha kwaye inokuthatha iveki. I-Silicon egqityiweyo inobunzima obuziikhilogram ezili-100 kwaye inokwenza ngaphezulu kwe-3,000 ye-000.

I-wafer inqunyulwe ibe zizilayiri ezinqabileyo usebenzisa ucingo lwedayimani. Ukuchaneka kwezixhobo zokusika isilicon kuphezulu kakhulu, kwaye abaqhubi kufuneka babekwe esweni, okanye baya kuqala ukusebenzisa izixhobo zokwenza izinto ezizithukweni kwiinwele zabo. Intshayelelo emfutshane kwimveliso ye-seficn ye-silicon yenziwe lula kwaye ayikhathali ngokupheleleyo imirhumo kahlobo. Kodwa ithembekile ukuba inike imvelaphi yokuqonda okunzulu kweshishini lesilika.

Ubonelelo kunye nolwalamano lwemfuno lwe-sefer ye-silicon

Imakethi yaseSilicon ye-Silicon ilawulwa ziinkampani ezine. Ixesha elide, imakethi ikwimeko ebuthathaka phakathi kokunikezelwa kunye nemfuno.
Ukwehla kwentengiso ye-semiconductor ngo-2023 kukhokelele kwimarike ukuba ibe kwimeko ye-overessply, kubangela ukuba uluhlu lwangaphakathi lwabavelisi kunye nabangaphandle luphezulu. Nangona kunjalo, le yimeko yethutyana. Njengoko imakethi iphinde iphinde iphinde iphinde iphinde iphinde iphinde ibuyiselwe, ishishini liza kubuya kungekudala kumda womthamo kwaye kufuneka ifezekise iimfuno ezongeziweyo ezenziwa yi-AI. Inguqu evela kushiyi-soyilo olusekwe kwi-CPU ukuya kwikhompyuter ekhawulezileyo iya kuba nefuthe kumzi mveliso, njengoko kunjalo, oku kunokuba nefuthe kwicandelo le-semicondcuctor.

Iyunithi yokuPhakanyiswa kweMifanekiso

Njengoko imfuno yokunyuka kwentsebenzo, abavelisi be-GPU kufuneka boyise ezinye iindlela zoyilo zokufezekisa intsebenzo ephezulu kwi-GPU. Ngokucacileyo, ukwenza i-chip enkulu yenye indlela yokufezekisa intsebenzo ephezulu, njengoko i-eletrone ayithandi ukuhamba imigama emide phakathi kweetshiphu ezahlukeneyo, nto leyo yokunciphisa intsebenzo. Nangona kunjalo, kukho umda ofanelekileyo wokwenza i-chip enkulu, eyaziwa ngokuba "ngumda we-retina".

Umda weLithographithi ubhekisa kubungakanani be-chip enokutyhilwa kwinyathelo elinye kumatshini weliligraphy osetyenziswe kwimveliso ye-semicondcucy. Lo mda ugqitywe ngobukhulu bemimandla ye-magnetic ye-litnegraphy, ngakumbi inyathelo okanye iskena esisetyenziswa kwinkqubo yelili. Kwitekhnoloji yakutshanje, umda wemaski uhlala malunga ne-858 yemilizi ye-millimitha. Lo mnqophiso umda ubaluleke kakhulu kuba ichaza eyona ndawo iphezulu enokuthi ibekwe kwi-wafer kwi-wafer kwi-ekubonakaliseni. Ukuba i-wafer inkulu kakhulu kunowona mda, ukuvezwa okuninzi kuya kufuneka kwipateni epheleleyo, engenakwenzeka kwimveliso yobuninzi ngenxa yobunzima kunye nemiceli mngeni yokulungelelanisa. I-GB200 ye-GB200 iya koyisa lo mda ngokudibanisa i-chip ezimbini ze-chip ngokulinganiselwa komda kwi-interladen ye-silicon, ukwenza i-super-paricle-inqongo likhulu. Eminye imiqobo yentsebenzo yimali yememori kunye nomgama ukuya kwimemori (okt yememori bandwidth). Indawo entsha ye-GPU yoyisa le ngxaki ngokusebenzisa inkumbulo ye-Bandwidth ephezulu kakhulu (HBM) efakwe kwi-interposer efanayo ye-GPU enee-chips ezimbini ze-GPU. Ukusuka kwimbono yesilicon, ingxaki nge-HBM kukuba indawo nganye ye-silicon iphindwe kabini yedram yemveli ngenxa yoMntu onoMntu oPhezulu kwi-Intanethi efunekayo kwi-bandwidth ephezulu. I-HBM ikwadibanisa i-chip yolawulo lwe-Logic kwisitayile ngasinye, yandisa indawo ye-silicon. Ukubalwa okuqhekeka kubonisa ukuba indawo ye-silicon isetyenziswe kwi-2.5d GPU uyilo ngamaxesha ama-3 ukuya kwezendalo. Njengoko bekutshiwo ngaphambili, ngaphandle kokuba iinkampani ezichithwe zilungiselelwe olu tshintsho, isikhundla se-silicon safenefeness sinokuphinda siqine.

Umthamo wexesha elizayo weNtengiso ye-Silicon Wafer

Eyokuqala yemithetho emithathu yemveliso ye-semicondcucy kukuba eyona mali ifuna ukutyalwa xa imali incinci ifumaneka. Oku kungenxa yendalo yomzi-mveliso, kwaye iinkampani ze-semiconductor zinexesha elinzima emva koMgaqo. Njengoko kubonisiwe kumzobo, uninzi lwabavelisi baseSilicon Abafene baqonda ifuthe lolo tshintsho kwaye baphinde baphindaphindeka inkcitho yabo yekota kwikota ezimbalwa ezidlulileyo. Ngaphandle kweemeko ezinzima zentengiso, oku kusenjalo. Yintoni enomdla ngakumbi kukuba le meko iqhubeke ixesha elide. Iinkampani ze-Silicon ze-selicon ze-selicon zethamsanqa okanye zazi into ukuba abanye bangazenzi. I-semiconductor the chain ngamatshini onokuqikelela ikamva. Ikamva lakho lisenokuba ngumntu odlulileyo lomnye umntu. Ngelixa sisoloko sifumana iimpendulo, phantse sisoloko sifumana imibuzo efanelekileyo.