Iindaba zeShishini: I-GPU inyusa imfuno yee-wafers ze-silicon

I-Silicon yeyona nto ixhaphakileyo eMhlabeni, emva kwe-oksijini, kwaye yeyesixhenxe yezona zinto zixhaphakileyo kwindalo iphela. I-Silicon yi-semiconductor, oko kuthetha ukuba ineempawu zombane phakathi kwee-conductors (ezifana ne-copper) kunye nee-insulators (ezifana neglasi). Inani elincinci lee-athomu zangaphandle kwisakhiwo se-silicon linokutshintsha ngokusisiseko indlela esebenza ngayo, ngoko ke ubunyulu be-silicon ye-semiconductor-grade kufuneka buphakame ngokumangalisayo. Ubunyulu obuncinci obamkelekileyo be-silicon ye-electronic-grade yi-99.999999%.

Oku kuthetha ukuba i-athomu enye kuphela engeyiyo i-silicon evumelekileyo kwi-athomu nganye eziibhiliyoni ezilishumi. Amanzi okusela alungileyo avumela iimolekyuli ezingengawo amanzi ezingama-40 ezigidi, nto leyo engaphantsi ngokuphindwe ka-50 ezigidi kune-silicon ye-semiconductor-grade.

Abavelisi be-silicon wafer engenanto kufuneka baguqule i-silicon ecocekileyo kakhulu ibe zizakhiwo ezigqibeleleyo ze-single-crystal. Oku kwenziwa ngokungenisa i-single mother crystal kwi-silicon enyibilikisiweyo kubushushu obufanelekileyo. Njengoko iikristale ezintsha ziqala ukukhula zijikeleze i-mother crystal, i-silicon ingot ikhula kancinci kwi-silicon enyibilikisiweyo. Inkqubo icotha kwaye ingathatha iveki. I-silicon ingot egqityiweyo inobunzima obumalunga ne-100 yeekhilogram kwaye inokwenza ii-wafers ezingaphezu kwama-3,000.

Iiwafers zinqunyulwa zibe ziziqwenga ezibhityileyo kusetyenziswa ucingo lwedayimani olucolekileyo kakhulu. Ukuchaneka kwezixhobo zokusika isilicon kuphezulu kakhulu, kwaye abaqhubi kufuneka babekwe esweni rhoqo, okanye baza kuqala ukusebenzisa izixhobo ukwenza izinto ezingenangqondo kwiinwele zabo. Intshayelelo emfutshane yokuveliswa kweewafers zesilicon ilula kakhulu kwaye ayiniki xabiso ngokupheleleyo kwigalelo leengcali; kodwa kunethemba lokuba iya kunika imvelaphi yokuqonda okunzulu ngeshishini lewafers zesilicon.

Ubudlelwane bokubonelela kunye nemfuno yee-wafers ze-silicon

Imarike ye-silicon wafer ilawulwa ziinkampani ezine. Kangangexesha elide, imakethi ibisoloko ikwimeko entle phakathi kokubonelela kunye nemfuno.
Ukwehla kwentengiso yee-semiconductor ngo-2023 kukhokelele ekubeni imakethi ibe kwimeko yokuthengiswa kakhulu, nto leyo ebangele ukuba ii-inventri zangaphakathi nezangaphandle zabenzi bee-chip zibe phezulu. Nangona kunjalo, le yimeko yexeshana nje. Njengoko imakethi ibuyela kwimeko yayo entle, eli shishini liza kubuyela ngokukhawuleza kwinqanaba lomthamo kwaye kufuneka lihlangabezane neemfuno ezongezelelweyo ezibangelwe yinguqu ye-AI. Utshintsho oluvela kuyilo lwendabuko olusekelwe kwi-CPU ukuya kwikhompyutha ekhawulezileyo luya kuba nefuthe kulo lonke imboni, njengoko Nangona kunjalo, oku kunokuba nefuthe kumacandelo aphantsi eshishini le-semiconductor.

Uyilo lweYunithi yokuCwangcisa iMifanekiso (i-GPU) lufuna indawo engaphezulu ye-silicon

Njengoko imfuno yokusebenza isanda, abavelisi beGPU kufuneka boyise imida ethile yoyilo ukuze bafumane ukusebenza okuphezulu kwi-GPU. Ngokucacileyo, ukwenza i-chip ibe nkulu yenye indlela yokufumana ukusebenza okuphezulu, njengoko ii-electron zingathandi ukuhamba imigama emide phakathi kwee-chips ezahlukeneyo, nto leyo ethintela ukusebenza. Nangona kunjalo, kukho umda osebenzayo ekwenzeni i-chip ibe nkulu, owaziwa ngokuba yi-"retina limit".

Umda we-lithography ubhekisa kubukhulu obukhulu be-chip enokuvezwa kwinqanaba elinye kumatshini we-lithography osetyenziswa kwimveliso ye-semiconductor. Lo mda umiselwa bubungakanani obukhulu be-magnetic field yezixhobo ze-lithography, ngakumbi i-stepper okanye i-scanner esetyenziswa kwinkqubo ye-lithography. Kwitekhnoloji yamva nje, umda wemaski uhlala umalunga ne-858 square millimeters. Lo mda wobungakanani ubaluleke kakhulu kuba umisela indawo ephezulu enokubekwa kwi-wafer kwi-exposure enye. Ukuba i-wafer inkulu kunolu mda, kuya kufuneka ii-exposure ezininzi ukuze kupendwe ngokupheleleyo i-wafer, nto leyo engenakwenzeka kwimveliso yobuninzi ngenxa yobunzima kunye nemingeni yokulungelelanisa. I-GB200 entsha iya koyisa lo mda ngokudibanisa ii-substrates ezimbini ze-chip kunye nemida yobukhulu be-particle kwi-silicon interlayer, yenze i-substrate ene-super-particle-limited ephindwe kabini. Eminye imida yokusebenza bubungakanani bememori kunye nomgama ukuya kuloo memori (okt i-bandwidth yememori). Uyilo olutsha lwe-GPU luyoyisa le ngxaki ngokusebenzisa i-stacked high-bandwidth memory (HBM) efakwe kwi-silicon interposer efanayo kunye nee-GPU chips ezimbini. Ngokwembono ye-silicon, ingxaki nge-HBM kukuba indawo nganye ye-silicon iphindwe kabini kune-DRAM yendabuko ngenxa ye-interface ephezulu efunekayo kwi-bandwidth ephezulu. I-HBM ikwadibanisa i-logic control chip kwi-stack nganye, inyusa indawo ye-silicon. Ubalo oluqhelekileyo lubonisa ukuba indawo ye-silicon esetyenziswa kwi-2.5D GPU architecture iphindwe ka-2.5 ukuya ka-3 kune-2.0D architecture yendabuko. Njengoko bekutshiwo ngaphambili, ngaphandle kokuba iinkampani ze-foundry zilungele olu tshintsho, umthamo we-silicon wafer unokuqina kakhulu kwakhona.

Umthamo wexesha elizayo wemarike ye-silicon wafer

Umthetho wokuqala kwemithathu yokwenziwa kwee-semiconductor kukuba imali eninzi kufuneka ityalwe xa kukho imali encinci ekhoyo. Oku kungenxa yendalo yokujikeleza kweshishini, kwaye iinkampani ze-semiconductor zinobunzima bokulandela lo mthetho. Njengoko kubonisiwe kumfanekiso, uninzi lwabavelisi be-silicon wafer baye baqaphela impembelelo yolu tshintsho kwaye baphantse baphinda kathathu iindleko zabo zekota nganye kwiikota ezimbalwa ezidlulileyo. Nangona iimeko zemarike zinzima, oku kusenjalo. Okunomdla ngakumbi kukuba le ndlela ibisoloko iqhubeka ixesha elide. Iinkampani ze-silicon wafer zinethamsanqa okanye ziyazi into abanye abangayaziyo. Ikhonkco lokubonelela nge-semiconductor ngumatshini wexesha onokuxela kwangaphambili ikamva. Ikamva lakho lisenokuba lixesha lomnye umntu. Nangona singasoloko sifumana iimpendulo, phantse sihlala sifumana imibuzo efanelekileyo.