Icandelo le-Samsung Electronics 'Device Solutions likhawulezisa uphuhliso lwemathiriyeli entsha yokupakisha ebizwa ngokuba yi "glass interposer", ekulindeleke ukuba ithathe indawo ye-silicon interposer yexabiso eliphezulu. I-Samsung ifumene izindululo ezivela kwiChemtronics kunye nePhiloptics zokuphuhlisa obu buchwepheshe isebenzisa iglasi yeCorning kwaye ivavanya ngenkuthalo amathuba entsebenziswano ekurhwebeni kwayo.
Okwangoku, i-Samsung Electro - Mechanics iphinda iqhubekisele phambili uphando kunye nophuhliso lweebhodi zokuthwala iglasi, icwangcisa ukuphumeza imveliso yobuninzi ngo-2027. Xa kuthelekiswa ne-silicon interposer yendabuko, i-glass interposer ayinayo iindleko eziphantsi kuphela kodwa iphinde ibe nozinzo oluhle kakhulu lwe-thermal kunye nokumelana ne-seismic, enokuthi ilula ngokufanelekileyo inkqubo yokuvelisa i-micro-circuit circuit.
Kwishishini lemathiriyeli yokupakisha ye-elektroniki, olu tshintsho lunokuzisa amathuba amatsha kunye nemingeni. Inkampani yethu iya kubeka iliso elibukhali le nkqubela phambili yetekhnoloji kwaye izabalazele ukuphuhlisa imathiriyeli yokupakisha enokuthi ihambelane ngcono neendlela ezintsha zokupakisha ze-semiconductor, iqinisekisa ukuba iiteyiphu zethu zokuthwala, iiteyiphu zokugquma, kunye neereel zinokubonelela ngokhuseleko oluthembekileyo kunye nenkxaso yemveliso ye-semiconductor yesizukulwana esitsha.
Ixesha lokuposa: Feb-10-2025