Icandelo leSamsung Electronics' Device Solutions likhawulezisa uphuhliso lwezixhobo ezintsha zokupakisha ezibizwa ngokuba yi "glass interposer", ekulindeleke ukuba zithathe indawo yesilicon interposer ebiza kakhulu. ISamsung ifumene izindululo ezivela kwiChemtronics and Philoptics zokuphuhlisa obu buchwephesha kusetyenziswa iCorning glass kwaye ivavanya ngokukhutheleyo amathuba entsebenziswano okuthengiswa kwayo.
Okwangoku, iSamsung Electro - Mechanics ikwaqhubela phambili uphando kunye nophuhliso lweebhodi zokuthwala iglasi, iceba ukufezekisa imveliso enkulu ngo-2027. Xa kuthelekiswa nee-silicon interposer zemveli, ii-glass interposer azinazo nje iindleko eziphantsi kodwa zikwanazo nokuzinza okuphezulu kobushushu kunye nokumelana nenyikima, nto leyo enokwenza lula inkqubo yokuvelisa ii-micro-circuit.
Kwishishini lezinto zokupakisha ze-elektroniki, olu tshintsho lunokuzisa amathuba amatsha kunye nemingeni. Inkampani yethu iya kujonga ngokusondeleyo olu phuculo lwetekhnoloji kwaye izame ukuphuhlisa izinto zokupakisha ezinokuhambelana ngcono neendlela ezintsha zokupakisha ze-semiconductor, iqinisekisa ukuba iitheyiphu zethu zokuthwala, iitheyiphu zokugquma, kunye neereyile zinokubonelela ngokhuseleko oluthembekileyo kunye nenkxaso kwiimveliso ze-semiconductor zesizukulwana esitsha.
Ixesha leposi: Februwari-10-2025