I-San Jose - I-Samsung Elektroniki CO. iya kuqalisa iiPutowding ezintathu (HBM) kwiMemori ye-Bandwidth Commol ye-chip yesiqingatha se-HBM4 ngenxa yenkampani kunye nemithombo yolwazi.
Nge-20 kaJuni, i-chipmaaker enkulu yehlabathi ityhila itekhnoloji yayo ye-chip ye-chip ye-chip kunye neendlela zenkonzo kwiforum yokwakhiwa kwe-2024 ebanjelwe eSan Jose, eCalifornia.
Yayilixesha lokuqala uSamsung ukukhupha itekhnoloji ye-3D ye-HBM chips kumnyhadala woluntu. Okwangoku, iitshipsi ze-HBM zipakishwe ikakhulu ngetekhnoloji ye-2.5d.
Kwafika malunga neeveki ezimbini emva kokuba umsunguli we-Nvidia kunye neJersen Cosen Hersen Heruten ityhile uyilo lweplanethi yayo ye-AI i-AI i-rubin ngexesha lentetho eTaiwan.
I-HBM4 iya kungeniswa kwimodeli entsha ye-rubin ye-rubin ye-rubin ye-GPU kulindeleke ukuba ibethe intengiso ngo-2026.
Unxibelelwano oluthe nkqo
Itekhnoloji yeTekhnoloji ye-Samsung ye-HBM ye-HBM ithe tye e-GPU yokufunda i-GPU yokufunda idatha yokufunda kunye nokuqhutywa kwedatha, itekhnoloji ithathelwe ingqalelo njengomdlalo we-AI okhula ngokukhawuleza.
Okwangoku, iitshipsi ze-HBM zidibene ngokuthe tye nge-GPU kwi-interposer ye-silicon phantsi kwetekhnoloji ye-2.5D.
Ngokuthelekisa, ukupakisha i-3D akudingi i-interposer ye-silicon, okanye i-subtate enqabileyo ephakathi kweetshipsi ukubavumela ukuba banxibelelane kwaye basebenze kunye. I-Samsung Debs itekhnoloji yayo entsha yokupakisha njengoko i-Saint-D, imfutshane yeTekhnoloji yoNxibelelwano lwe-Samsung-D.
Inkonzo yeSpeckey
Inkampani yaseSouth Korea iqondakala ukuba ikhuphe ukupakisha i-3D ye-HBM kwi-jikati.
Ukwenza njalo, iqela lepakethi eliphathekayo liya kuqhagamshelana ngokuthe nkqo i-HBM chips kwiCandelo leMeko yeShishini kunye ne-GPU ehlanganisene kwiinkampani ezinobungozi ngeyunithi yakhe.
"Ukupakisha i-3D kunciphisa ukusetyenziswa kwamandla kunye nokulibaziseka kwamandla, ukuphucula umgangatho weempawu zombane ze-semiconductor chips," utshilo igosa le-Emsung elektroniki. Ngo-2027, i-Samsung icebo lokwazisa itekhnoloji yokudibanisa yonke i-heterogeneous eqokelela izinto ezibonakalayo zonyusa isantya sosulelo lwedatha ye-semicontued kwiphakheji enye ye-AI.
Ngokuhambelana nemfuno ekhulayo yamandla asezantsi, i-chips ephezulu yokusebenza, i-HBM iqinisekisiwe ukuba yenze i-30% yemakethi ye-Dram ngo-2025 ukusuka kwi-21% ngo-2024, inkampani yophando, inkampani yophando, inkampani yophando.
Uphando lophando lwe-MGI Imakethi yokupakisha i-Advanced, kubandakanya ukupakisha i-3D, ukukhulisa ukuya kwi-80 yezigidigidi nge-2032, kuthelekiswa ne- $ 34,5 yezigidigidi ngonyaka wama-2023.
IXESHA LOKUQALA: Jun-10 ukuya kwi-2024