I-SAN JOSE -- I-Samsung Electronics Co. iza kuphehlelela iinkonzo zokupakisha ezinamacala amathathu (3D) kwimemori ye-bandwidth ephezulu (HBM) phakathi konyaka, itekhnoloji elindeleke ukuba yaziswe kwimodeli yesithandathu ye-intelligence chip ye-HBM4 ngenxa ye-2025, ngokwenkampani kunye nemithombo yoshishino.
Ngomhla wama-20 kuJuni, umatshini omkhulu wememori wehlabathi watyhila itekhnoloji yokupakishwa kwetshiphu yamva nje kunye nemephu yendlela yenkonzo kwi-Samsung Foundry Forum 2024 ebibanjelwe eSan Jose, eCalifornia.
Yayilixesha lokuqala i-Samsung ukukhulula itekhnoloji yokupakisha ye-3D yeetshiphusi ze-HBM kumsitho kawonke-wonke.Okwangoku, iitshiphusi ze-HBM zipakishwe ikakhulu ngetekhnoloji ye-2.5D.
Kwafika malunga neeveki ezimbini emva kokuba uNvidia umququzeleli kunye noMlawuli oyiNtloko uJensen Huang watyhila i-architecture yesizukulwana esitsha seqonga layo le-AI iRubin ngexesha lentetho eTaiwan.
I-HBM4 inokuthi ifakwe kwimodeli entsha yeRubin GPU kaNvidia ekulindeleke ukuba ifike kwintengiso ngo-2026.
UQHAGAMSHELO OKUQONDILE
Itekhnoloji yokupakisha yamva nje ye-Samsung ifaka iitshiphusi ze-HBM ezipakishwe ngokuthe nkqo phezu kwe-GPU ukukhawulezisa ukufunda kwedatha kunye nokusetyenzwa kwe-inference, itekhnoloji ethathwa njengotshintsho lomdlalo kwimakethi ye-chip ekhula ngokukhawuleza ye-AI.
Okwangoku, iitshiphusi ze-HBM ziqhagamshelwe ngokuthe tye kunye ne-GPU kwi-silicon interposer phantsi kwetekhnoloji yokupakisha ye-2.5D.
Ngokuthelekisa, ukupakishwa kwe-3D akufuni i-silicon interposer, okanye i-substrate encinci ehlala phakathi kweechips ukubavumela ukuba banxibelelane kwaye basebenze kunye.Isamsung ibiza itekhnoloji entsha yokupakisha njenge-SAINT-D, emfutshane ye-Samsung Advanced Interconnection Technology-D.
INKONZO ye-TURNKEY
Inkampani yaseMzantsi Korea iqondwa ukuba ibonelela ngokupakishwa kwe-3D HBM kwi-turnkey.
Ukwenza njalo, iqela layo lokupakisha eliphucukileyo liya kuqhagamshela ngokuthe nkqo iitshiphusi ze-HBM eziveliswe kwicandelo leshishini lenkumbulo kunye nee-GPU ezidityaniselwe iinkampani ezingenamsebenzi ngeyunithi yazo.
"Ukupakishwa kwe-3D kunciphisa ukusetyenziswa kwamandla kunye nokulibaziseka kokulungiswa, ukuphucula umgangatho weempawu zombane zeetshiphu ze-semiconductor," latsho igosa le-Samsung Electronics.Ngo-2027, i-Samsung iceba ukwazisa itekhnoloji yokudityaniswa kwe-heterogeneous-in-one ebandakanya izinto ezibonakalayo ezonyusa kakhulu isantya sothumelo lwedatha yee-semiconductors kwiphakheji enye edibeneyo ye-AI accelerators.
Ngokuhambelana nemfuno ekhulayo yamandla aphantsi, iichips ezisebenza kakhulu, i-HBM kulindeleke ukuba yenze i-30% yemarike ye-DRAM ngo-2025 ukusuka kwi-21% ngo-2024, ngokutsho kweTrendForce, inkampani yophando yaseTaiwan.
UPhando lwe-MGI luqikelele imarike yokupakisha ephucukileyo, kubandakanywa ukupakishwa kwe-3D, ukukhula ukuya kutsho kwi-80 yeebhiliyoni zeedola ngo-2032, xa kuthelekiswa ne-34.5 yeebhiliyoni zeedola ngo-2023.
Ixesha lokuposa: Jun-10-2024