ISAN JOSE -- I-Samsung Electronics Co. iza kuqalisa iinkonzo zokupakisha ezinemilinganiselo emithathu (3D) zememori ye-bandwidth ephezulu (HBM) kulo nyaka, ubuchwepheshe okulindeleke ukuba buziswe kwimodeli yesizukulwana sesithandathu se-HBM4 yetshiphu yobukrelekrele bokwenziwa eza kufunyanwa ngo-2025, ngokutsho kwemithombo yenkampani kunye noshishino.
Ngomhla wama-20 kweyeSilimela, inkampani enkulu kunazo zonke ehlabathini evelisa ii-chip zememori yatyhila ubuchwepheshe bayo bamva nje bokupakisha ii-chip kunye nemigaqo yenkonzo kwi-Samsung Foundry Forum 2024 eyayibanjelwe eSan Jose, eCalifornia.
Yayilixesha lokuqala iSamsung ikhupha ubuchwepheshe bokupakisha be-3D beetships ze-HBM kumsitho kawonke-wonke. Okwangoku, iitships ze-HBM zipakishwe kakhulu ngeteknoloji ye-2.5D.
Oku kwenzeke malunga neeveki ezimbini emva kokuba umsunguli weNvidia kunye neNtloko yeSebe uJensen Huang etyhile uyilo lwesizukulwana esitsha lweqonga layo le-AI uRubin ngexesha lentetho eTaiwan.
I-HBM4 isenokuba ifakwe kwimodeli entsha yeNvidia iRubin GPU ekulindeleke ukuba ifike kwimarike ngo-2026.
UQHAGAMSHELWANO OLUNGILEYO
Itekhnoloji yamva nje yokupakisha yeSamsung ineetships zeHBM ezibekwe ngokuthe nkqo phezu kweGPU ukuze kukhawuleziswe ukufunda idatha kunye nokucubungula ulwazi, itekhnoloji ethathwa njengetshintsha umdlalo kwimarike yeetships ze-AI ekhula ngokukhawuleza.
Okwangoku, iitships ze-HBM ziqhagamshelwe ngokuthe tye kwi-GPU kwi-silicon interposer phantsi kwetekhnoloji yokupakisha ye-2.5D.
Xa kuthelekiswa, ukupakisha kwe-3D akudingi i-silicon interposer, okanye i-substrate encinci ephakathi kweetships ukuze zikwazi ukunxibelelana nokusebenzisana. I-Samsung ibiza itekhnoloji yayo entsha yokupakisha ngokuthi yi-SAINT-D, isishunqulelo se-Samsung Advanced Interconnection Technology-D.
INKONZO YE-TURNKEY
Le nkampani yaseMzantsi Korea iyaqondakala ukuba inika ukupakisha kwe-3D HBM ngokusekelwe kwi-turnkey.
Ukuze benze njalo, iqela labo eliphambili lokupakisha liza kudibanisa ngokuthe nkqo iitships ze-HBM eziveliswe kwicandelo labo leememori kunye neeGPU ezidityaniswe kwiinkampani ezingenazo iingcinga yiyunithi yalo yokwenziwa kwezinto.
“Ukupakisha kwe-3D kunciphisa ukusetyenziswa kwamandla kunye nokulibaziseka kokucubungula, kuphucula umgangatho wemiqondiso yombane yeetships ze-semiconductor,” utshilo igosa le-Samsung Electronics. Ngo-2027, i-Samsung iceba ukwazisa itekhnoloji yokudibanisa eyahlukileyo equka izinto ezibonakalayo ezonyusa kakhulu isantya sokudluliselwa kwedatha yee-semiconductors kwiphakheji enye edibeneyo yee-accelerators ze-AI.
Ngokuhambelana nemfuno ekhulayo yeetships ezinamandla aphantsi nezisebenza kakuhle, i-HBM kulindeleke ukuba yenze i-30% yemarike ye-DRAM ngo-2025 ukusuka kwi-21% ngo-2024, ngokutsho kweTrendForce, inkampani yophando yaseTaiwan.
Uphando lwe-MGI luqikelela ukuba imakethi yokupakisha ephucukileyo, kuquka nokupakisha kwe-3D, iza kukhula iye kwi-$80 yeebhiliyoni ngo-2032, xa ithelekiswa ne-$34.5 yeebhiliyoni ngo-2023.
Ixesha lokuthumela: Juni-10-2024