Kwicandelo lokwenziwa kwe-semiconductor, imodeli yokwenziwa kotyalo-mali olukhulu lwemveli, olunemali ephezulu ijongene nenguqu enokwenzeka. Ngomboniso ozayo we-"CEATEC 2024", iMinimum Wafer Fab Promotion Organisation ibonisa indlela entsha yokuvelisa isemiconductor esebenzisa izixhobo zokwenziwa kwesemiconductor encinci kakhulu kwiinkqubo zelithography. Olu tshintsho luzisa amathuba angazange abonwe kumashishini amancinci naphakathi (ii-SME) kunye namashishini aqalayo. Eli nqaku liza kudibanisa ulwazi olufanelekileyo ukuphonononga imvelaphi, izibonelelo, imingeni, kunye nefuthe elinokubakho lobuncinci betekhnoloji ye-wafer fab kwishishini le-semiconductor.
Ukwenziwa kweSemiconductor lishishini elinobutyebi obuphezulu kunye neteknoloji. Ngokwemveli, ukwenziwa kwe-semiconductor kufuna iifektri ezinkulu kunye namagumbi acocekileyo ukuvelisa ngobuninzi ii-12-intshi zamawafa. Utyalo-mali oluyinkunzi kwi-wafer fab nganye enkulu ludla ngokufikelela kwi-2 yetriliyoni yen (malunga ne-120 yeebhiliyoni zeerandi), nto leyo eyenza kubenzima kwii-SME kunye nabaqalayo ukungena kulo mmandla. Nangona kunjalo, ngokuvela kwetekhnoloji encinci ye-wafer fab, le meko iyatshintsha.
Ubuncinci be-wafer fabs zisistim zokwenziwa kwe-semiconductor ezitsha ezisebenzisa ii-intshi ze-0.5-intshi, ezinciphisa ngokubonakalayo isikali semveliso kunye notyalo-mali olukhulu xa kuthelekiswa nee-wafers zesiqhelo eziyi-12-intshi. Utyalo-mali oluyinkunzi kwesi sixhobo sokuvelisa kuphela malunga ne-500 yezigidi zeeyen (malunga ne-23.8 yezigidi zee-RMB), okwenza ukuba ii-SME kunye neziqalo ziqalise ukuveliswa kwe-semiconductor notyalo-mali oluphantsi.
Imvelaphi yobuncinci beteknoloji ye-wafer fab inokulandelwa kwiprojekthi yophando eyaqalwa yiNational Institute of Advanced Industrial Science and Technology (AIST) eJapan ngo-2008. Le projekthi ijolise ekudaleni umkhwa omtsha kwimveliso ye-semiconductor ngokufezekisa iindidi ezininzi, imveliso encinci. Eli nyathelo, elikhokelwa nguMphathiswa wezoQoqosho, uRhwebo kunye noShishino waseJapan, libandakanya intsebenziswano phakathi kweenkampani ze-140 zaseJapan kunye nemibutho yokuphuhlisa isizukulwana esitsha seenkqubo zokuvelisa, ezijolise ekunciphiseni kakhulu iindleko kunye nemiqobo yobugcisa, ukuvumela abavelisi beemoto kunye nezixhobo zasekhaya ukuba bavelise i-semiconductors kunye nezivamvo abazifunayo.
**Izinto eziluncedo zobuChwephesha beTekhnoloji yeWafer Fab encinci:**
1. **Utyalo-mali oluNcitshisiweyo lweNkunzi oluNcitshiswa ngokuBalulekileyo:** Iimpahla zemveli ezinkulu ze-wafer zifuna utyalo-mali oluyinkunzi olugqitha kumakhulu eebhiliyoni zeeyen, ngelixa utyalo-mali ekujoliswe kulo kubuncinane be-wafer fabs yi-1/100 ukuya kwi-1/1000 yaloo mali. Ekubeni isixhobo ngasinye sincinci, akukho mfuneko yeendawo ezinkulu zefektri okanye ii-photomasks zokubunjwa kweesekethe, ukunciphisa kakhulu iindleko zokusebenza.
2. **IiModeli eziguquguqukayo kunye nezahlukeneyo zeMveliso:** Ubuncinci belaphu le-wafer lijolise ekwenziweni kweemveliso ezahlukeneyo zeebhetshi ezincinci. Le modeli yemveliso ivumela ii-SME kunye neziqalo ukuba zikhawuleze ukwenza ngokwezifiso kwaye zivelise ngokweemfuno zabo, ukuhlangabezana nemfuno yemarike yeemveliso ezenziwe ngokwezifiso kunye neentlobo ezahlukeneyo ze-semiconductor.
3. **IiNkqubo zeMveliso eziLula:** Izixhobo zokuvelisa kwiilaphu ezincinci ze-wafer zinemilo efanayo kunye nobukhulu kuzo zonke iinkqubo, kunye nezikhongozeli zokuthutha i-wafer (i-shuttles) zizonke kwinqanaba ngalinye. Ekubeni izixhobo kunye ne-shuttles zisebenza kwindawo ecocekileyo, akukho mfuneko yokugcina amagumbi amakhulu acocekileyo. Olu yilo lunciphisa kakhulu iindleko zokuvelisa kunye nobunzima ngokusebenzisa iteknoloji ecocekileyo yendawo kunye neenkqubo zemveliso ezilula.
4. **UkuSetyenziswa koMbane okuPhantsi kunye nokuSetyenziswa koMbane waseKhaya:** Isixhobo sokuvelisa ubuncinci beempahla ezisicaba zikwabonisa ukusetyenziswa kombane okuphantsi kwaye zinokusebenza kumbane oqhelekileyo wendlu we-AC100V. Olu phawu luvumela ezi zixhobo ukuba zisetyenziswe kwiindawo ezingaphandle kwamagumbi acocekileyo, ukunciphisa ukusetyenziswa kwamandla kunye neendleko zokusebenza.
5. **Imijikelo yokuVelisa eMifutshane:** Ukwenziwa kwe-semiconductor enkulu kufuna ixesha elide lokulinda ukusuka kwi-odolo ukuya ekuhanjisweni, ngelixa i-minimum wafer fabs inokufikelela kwimveliso yangexesha yesixa esifunekayo se-semiconductor ngexesha elifunekayo. Olu ncedo lubonakala ngokukodwa kwiinkalo ezifana ne-Intanethi yeZinto (IoT), ezifuna iimveliso ezincinci ze-semiconductor ezincinci.
**Umboniso kunye nokuSetyenziswa kweTekhnoloji:**
Kumboniso we-"CEATEC 2024", iMinimum Wafer Fab Promotion Organisation ibonise inkqubo ye-lithography isebenzisa izixhobo zokuvelisa ze-semiconductor ezincinci. Ngethuba lomboniso, oomatshini abathathu balungiselelwa ukubonisa inkqubo ye-lithography, equka ukuchasa ukugquma, ukuvezwa kunye nophuhliso. Isitya sothutho se-wafer (i-shuttle) yayibanjwe ngesandla, yafakwa kwisixhobo, kwaye yasebenza ngokucofa iqhosha. Emva kokugqitywa, i-shuttle yathathwa kwaye yasetwa kwisixhobo esilandelayo. Ubume bangaphakathi kunye nenkqubela yesixhobo ngasinye ziboniswe kwiimonitha zazo.
Emva kokuba ezi nkqubo zintathu zigqityiwe, i-wafer yahlolwa phantsi kwe-microscope, ityhila ipateni ngamagama athi "Happy Halloween" kunye nomfanekiso wethanga. Lo mboniso awubonisanga nje ukubanakho kobuncinci betekhnoloji ye-wafer fab kodwa ukwaqaqambise ukuguquguquka kwayo kunye nokuchaneka okuphezulu.
Ukongeza, ezinye iinkampani ziqalisile ukuzama ubuncinci betekhnoloji ye-wafer fab. Ngokomzekelo, i-Yokogawa Solutions, i-subsidiary ye-Yokogawa Electric Corporation, isungule oomatshini bokwenza izinto ezilungelelanisiweyo kunye nobuhle, malunga nobukhulu bomatshini wokuthengisa isiselo, ngamnye uxhotyiswe ngemisebenzi yokucoca, ukufudumeza kunye nokuvezwa. Aba matshini ngokufanelekileyo benza umgca wemveliso we-semiconductor, kunye nommandla omncinci ofunekayo kwi-"mini wafer fab" umgca wokuvelisa kuphela ubukhulu beenkundla ezimbini zentenetya, nje i-1% yendawo ye-wafer fab ye-12-intshi.
Nangona kunjalo, amalaphu amancinci amancinci okwangoku asokola ukukhuphisana neefektri ezinkulu ze-semiconductor. Uyilo lwesekethe ye-Ultra-fine, ngakumbi kubuchwephesha benkqubo ephucukileyo (efana ne-7nm nangaphantsi), isaxhomekeke kwizixhobo eziphambili kunye nobuchule obukhulu bokuvelisa. Iinkqubo ze-0.5-intshi ze-wafer ze-wafer fabs zifaneleke ngakumbi ukwenza izixhobo ezilula, ezifana ne-sensor kunye ne-MEMS.
Ubuncinci belaphu ze-wafer zimele imodeli entsha ethembisayo yokwenziwa kwe-semiconductor. Ziphawulwa nge-miniaturization, ixabiso eliphantsi, kunye nokuguquguquka, kulindeleke ukuba babonelele ngamathuba amatsha emarike kwii-SME kunye neenkampani ezintsha. Izibonelelo zobuncinci be-wafer fabs zibonakala ngokukodwa kwiindawo ezithile zesicelo ezifana ne-IoT, izinzwa, kunye ne-MEMS.
Kwixesha elizayo, njengoko itekhnoloji ikhula kwaye inyuselwa ngakumbi, amalaphu amancinane e-wafer anokuba ngamandla abalulekileyo kushishino lokwenziwa kwe-semiconductor. Ababoneleli kuphela ngamashishini amancinci ngamathuba okungena kweli candelo kodwa banokuqhuba utshintsho kulwakhiwo lweendleko kunye neemodeli zemveliso yalo lonke ishishini. Ukufezekisa le njongo kuya kufuna iinzame ezingakumbi kubuchwephesha, uphuhliso lwetalente, kunye nokwakhiwa kwe-ecosystem.
Ekuhambeni kwexesha, unyuso oluyimpumelelo lwelaphu elisicaba lincinci linokuba nefuthe elinzulu kulo lonke ishishini le-semiconductor, ngakumbi malunga nokwahluka kwekhonkco lokubonelela, ukuguquguquka kwenkqubo yokuvelisa, kunye nolawulo lweendleko. Ukusetyenziswa ngokubanzi kobu buchwephesha kuya kunceda ukuqhubela phambili okutsha kunye nenkqubela phambili kwishishini le-semiconductor yehlabathi.
Ixesha lokuposa: Oct-14-2024