Kwicandelo lokuvelisa i-semiconductor, imodeli yemveli yokuvelisa utyalo-mali olukhulu, olunemali eninzi ijongene notshintsho olunokwenzeka. Ngomboniso ozayo we-"CEATEC 2024", iMinimum Wafer Fab Promotion Organisation ibonisa indlela entsha yokuvelisa i-semiconductor esebenzisa izixhobo zokuvelisa i-semiconductor ezincinci kakhulu kwiinkqubo ze-lithography. Olu tshintsho luzisa amathuba angazange abonwe ngaphambili kumashishini amancinci naphakathi (ii-SME) kunye neenkampani ezintsha. Eli nqaku liza kudibanisa ulwazi olufanelekileyo ukuze kuhlolwe imvelaphi, izibonelelo, imingeni, kunye nefuthe elinokubakho lobuchwepheshe be-minimum wafer fab kwishishini le-semiconductor.
Ukwenziwa kwee-semiconductors lishishini elisebenzisa imali eninzi kakhulu kunye netekhnoloji. Ngokwesiko, ukwenziwa kwee-semiconductor kufuna iifektri ezinkulu kunye namagumbi acocekileyo ukuze kuveliswe ii-wafers eziyi-12-intshi ngobuninzi. Utyalo-mali lwe-wafer fab nganye enkulu ludla ngokufikelela kwi-2 trillion yen (malunga ne-120 yeebhiliyoni zeerandi zeerandi), okwenza kube nzima kwii-SME kunye neenkampani ezintsha ukungena kweli candelo. Nangona kunjalo, ngokuvela kwetekhnoloji ye-wafer fab encinci, le meko iyatshintsha.
Ii-wafer fabs ezincinci ziinkqubo ezintsha zokwenza i-semiconductor ezisebenzisa ii-wafers ze-0.5-intshi, nto leyo enciphisa kakhulu ubungakanani bemveliso kunye notyalo-mali lwemali xa kuthelekiswa nee-wafers zemveli ze-12-intshi. Utyalo-mali lwezixhobo zokwenza olu shishino lumalunga ne-500 yezigidi zeerandi (malunga ne-23.8 yezigidi zeerandi), nto leyo evumela ii-SME kunye neenkampani ezintsha ukuba ziqalise ukuvelisa i-semiconductor ngotyalo-mali oluphantsi.
Imvelaphi yeteknoloji ye-minimum wafer fab inokulandelwa emva kwiprojekthi yophando eyaqalwa yiNational Institute of Advanced Industrial Science and Technology (AIST) eJapan ngo-2008. Le projekthi yayijolise ekudaleni umkhwa omtsha kwimveliso ye-semiconductor ngokufezekisa imveliso eyahlukeneyo, encinci. Eli phulo, elikhokelwa yiSebe lezoQoqosho, uRhwebo kunye noShishino laseJapan, lalibandakanya intsebenziswano phakathi kweenkampani kunye nemibutho yaseJapan eyi-140 ukuphuhlisa isizukulwana esitsha seenkqubo zokuvelisa, injongo kukunciphisa kakhulu iindleko kunye nemiqobo yobugcisa, ukuvumela abavelisi bezithuthi kunye nezixhobo zasekhaya ukuba bavelise ii-semiconductors kunye nee-sensors abazidingayo.
**Iingenelo zeTekhnoloji ye-Minimum Wafer Fab:**
1. **Utyalo-mali oluNciphiswe kakhulu kwiNkunzi:** Iifab ezinkulu zemveli ze-wafer zifuna utyalo-mali olungaphezulu kwamakhulu eebhiliyoni zeerandi, ngelixa utyalo-mali olujoliswe kwifab ezincinci ze-wafer luyi-1/100 ukuya kwi-1/1000 kuphela yaloo mali. Ekubeni isixhobo ngasinye sincinci, akukho mfuneko yeendawo ezinkulu zefektri okanye ii-photomasks zokwenziwa kwesekethe, nto leyo enciphisa kakhulu iindleko zokusebenza.
2. **Iimodeli zeMveliso eziGuquguqukayo neziHlukileyo:** Iifektri ezincinci ze-wafer zigxila ekuveliseni iintlobo ngeentlobo zeemveliso ezincinci. Le modeli yemveliso ivumela ii-SME kunye neenkampani ezintsha ukuba zilungelelanise kwaye zivelise ngokweemfuno zazo, zihlangabezane neemfuno zemarike zeemveliso ze-semiconductor ezenzelwe wena nezihlukeneyo.
3. **Iinkqubo Zemveliso Ezilula:** Izixhobo zokwenza izinto kwii-wafer fabs ezincinci zinemilo nobukhulu obufanayo kuzo zonke iinkqubo, kwaye izikhongozeli zokuthutha ii-wafer (ii-shuttles) ziqhelekile kwinqanaba ngalinye. Ekubeni izixhobo kunye nee-shuttles zisebenza kwindawo ecocekileyo, akukho mfuneko yokugcina amagumbi amakhulu ecocekile. Olu yilo lunciphisa kakhulu iindleko zokwenza izinto kunye nobunzima ngokusebenzisa ubuchwepheshe bokucoca bendawo kunye neenkqubo zemveliso ezilula.
4. **Ukusetyenziswa kwamandla aphantsi kunye nokusetyenziswa kwamandla ekhaya:** Izixhobo zokwenza izinto kwii-wafer fabs ezincinci nazo zinokusetyenziswa kwamandla aphantsi kwaye zinokusebenza kumandla aqhelekileyo e-AC100V ekhaya. Olu phawu luvumela ezi zixhobo ukuba zisetyenziswe kwiindawo ezingaphandle kwamagumbi acocekileyo, nto leyo enciphisa ukusetyenziswa kwamandla kunye neendleko zokusebenza.
5. **Imijikelo Yokwenziwa Emfutshane:** Ukwenziwa kwee-semiconductor ezinkulu kudla ngokufuna ixesha elide lokulinda ukusuka kwi-odolo ukuya ekuhanjisweni, ngelixa ii-wafer fabs ezincinci zinokuvelisa ubungakanani obufunekayo bee-semiconductor ngexesha elifanelekileyo. Le nzuzo ibonakala ngakumbi kwiindawo ezifana ne-Intanethi Yezinto (IoT), ezifuna iimveliso ze-semiconductor ezincinci, ezixutywe kakhulu.
**Umboniso kunye nokusetyenziswa kobuchwepheshe:**
Kumboniso we-"CEATEC 2024", iMinimum Wafer Fab Promotion Organisation ibonise inkqubo ye-lithography isebenzisa izixhobo zokwenza i-semiconductor ezincinci kakhulu. Ngexesha lomboniso, oomatshini abathathu bacwangciswa ukubonisa inkqubo ye-lithography, equka ukugquma, ukuvezwa, kunye nophuhliso. Isikhongozeli sokuthutha i-wafer (i-shuttle) sasibanjwe ngesandla, safakwa kwisixhobo, saza sasebenza ngokucinezela iqhosha. Emva kokugqitywa, i-shuttle yathathwa yaza yafakwa kwisixhobo esilandelayo. Imeko yangaphakathi kunye nenkqubela yesixhobo ngasinye yaboniswa kwiimonitha zazo.
Nje ukuba ezi nkqubo zintathu zigqityiwe, i-wafer yahlolwa nge-microscope, yabonisa ipateni enamagama athi "Happy Halloween" kunye nomfanekiso wethanga. Olu mboniso aluzange lubonise kuphela ukuba nokwenzeka kweteknoloji ye-wafer fab encinci kodwa lwagxininisa nokuguquguquka kwayo kunye nokuchaneka kwayo okuphezulu.
Ukongeza, ezinye iinkampani ziqalile ukuzama ubuchwepheshe be-minimum wafer fab. Umzekelo, i-Yokogawa Solutions, inkampani engaphantsi kwe-Yokogawa Electric Corporation, iqalise oomatshini bokuvelisa abalungelelanisiweyo nabathandekayo, abanobukhulu obufana noomatshini bokuthengisa iziselo, ngamnye uxhotyiswe ngemisebenzi yokucoca, ukufudumeza, kunye nokubonisa. Aba matshini benza ngokufanelekileyo umgca wemveliso ye-semiconductor, kwaye indawo encinci efunekayo kumgca wemveliso ye-"mini wafer fab" bubukhulu beenkundla ezimbini zetenisi kuphela, yi-1% kuphela yendawo ye-12-intshi wafer fab.
Nangona kunjalo, ii-minimum wafer fabs okwangoku ziyasokola ukukhuphisana neefektri ezinkulu ze-semiconductor. Uyilo lweesekethe ezicolekileyo kakhulu, ngakumbi kubuchwepheshe beenkqubo eziphambili (ezifana ne-7nm nangaphantsi), zisaxhomekeke kwizixhobo eziphambili kunye nobuchule bokuvelisa obukhulu. Iinkqubo ze-wafer ze-0.5-intshi zee-minimum wafer fabs zifanelekile ngakumbi ekwenzeni izixhobo ezilula, ezifana neesensors kunye ne-MEMS.
Ii-wafer fabs ezincinci zimele imodeli entsha ethembisayo kakhulu yokwenziwa kwee-semiconductor. Zibonakaliswa kukwenziwa kube lula, iindleko eziphantsi, kunye nokuguquguquka, kulindeleke ukuba zibonelele ngamathuba amatsha emarike kwii-SME kunye neenkampani ezintsha. Iingenelo zee-wafer fabs ezincinci zibonakala ngakumbi kwiindawo ezithile zesicelo ezifana ne-IoT, ii-sensors, kunye ne-MEMS.
Kwixesha elizayo, njengoko ubuchwepheshe bukhula kwaye bukhuthazwa ngakumbi, ii-wafer fabs ezincinci zinokuba ngamandla abalulekileyo kushishino lokuvelisa ii-semiconductor. Aziboneleli nje kuphela amashishini amancinci ngamathuba okungena kweli candelo kodwa zinokutshintsha indlela ezisebenza ngayo iindleko kunye neemodeli zemveliso kulo lonke eli shishini. Ukufezekisa le njongo kuya kufuna imizamo engakumbi kubuchwepheshe, uphuhliso lwetalente, kunye nokwakhiwa kwenkqubo yendalo.
Ekugqibeleni, ukukhuthazwa ngempumelelo kwe-minimum wafer fabs kunokuba nefuthe elikhulu kulo lonke ishishini le-semiconductor, ngakumbi ngokubhekiselele ekuhlukeni kwe-supply chain, ukuguquguquka kwenkqubo yokuvelisa, kunye nolawulo lweendleko. Ukusetyenziswa ngokubanzi kobu buchwepheshe kuya kunceda ukuqhuba ubuchule obutsha kunye nenkqubela phambili kwishishini le-semiconductor lehlabathi.
Ixesha leposi: Oktobha-14-2024